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NXP Semiconductors N.V. Extends S32 Automotive Platform with S32z and S32e Real-Time Processor Families for New Software-Defined Vehicles

2022-06-21 08:16:00

NXP Semiconductors N.V. has announced two new processor families that extend the benefits of NXP’s innovative S32 automotive platform with safe, high-performance real-time processing. The S32Z and S32E processor families help enable the automotive industry to accelerate the integration of diverse real-time applications for domain and zonal control, safety processing and vehicle electrification that are critical to the next generation of safer and more efficient vehicles. The S32Z processors are ideal for safety processing and domain and zonal control, while the S32E processors are ideal for electric vehicle (xEV) control and smart actuation. The software-compatible S32Z and S32E processors help enable software-defined vehicles, reduce software integration complexity and enhance security and safety. The automotive industry’s evolution to domain and zonal architectures is attractive to carmakers, enabling them to optimize wiring harnesses, reduce cost and weight and implement a more scalable and cost-effective, software-centric approach for developing and updating intelligent vehicles. This massive transformation requires new processors that offer higher performance, application isolation and memory expansion capabilities to support software-defined vehicles and future innovations. To design real-time processors with the performance and deterministic behaviors required for the next-generation of software-defined vehicles requires deep collaboration across the automotive ecosystem. Robert Bosch GmbH was a key partner in the rigorous process.NXP’s S32Z and S32E processors offer capabilities beyond today’s automotive microcontrollers with eight Arm® Cortex®-R52 processors cores with split-lock support that operate at up to 1 GHz to address the challenges of safely integrating deterministic, high-performance real-time applications. The processors isolate independent real-time applications with “core-to-pin” hardware virtualization and resource firewalls for freedom of interference. The processors are available with up to 64 MB of integrated flash memory for large, zero-downtime over-the-air (OTA) updates and support LPDDR4 DRAM and flash expansion memory with execute-in-place (XiP) mode for large applications and AUTOSAR® Adaptive applications. A communications accelerator (FlexLLCE) supporting 24 CAN interfaces, along with a Gigabit Ethernet switch supporting Time-Sensitive Networking (TSN), provides vehicle data seamlessly to “virtual ECUs” to improve efficiency and streamline software development. A hardware security engine (HSE) supports secure boot, accelerated security services and key management. The S32Z and S32E processors are certified to ISO/SAE 21434 for cybersecurity and ISO 26262 for ASIL D functional safety. The S32E processors add smart actuation capabilities, specifically in the form of advanced timers and high-resolution analog-to-digital converters and 5V analog and I/Os, for xEV integration applications with direct-drive motor control. The versatility and benefits of the S32Z and S32E processors are enabling leading global OEMs and tier ones to develop a wide range of new vehicle architectures with diverse real-time processing needs.

Clarion Events Limited, Transport Ticketing Global, Jun 28, 2022 through Jun 29, 2022

2022-06-18 07:11:00

Clarion Events Limited, Transport Ticketing Global, Jun 28, 2022 through Jun 29, 2022. Venue: London, United Kingdom.

NXP Semiconductors N.V. Presents at Transport Ticketing Global, Jun-28-2022

2022-06-18 07:11:00

NXP Semiconductors N.V. Presents at Transport Ticketing Global, Jun-28-2022 . Venue: London, United Kingdom.

NXP Semiconductors N.V. Debuts New MCX Portfolio of Microcontrollers for the Next Era of Advanced Industrial and Iot Edge Computing

2022-06-14 07:00:00

NXP Semiconductors announced the new MCX portfolio of microcontrollers, designed to advance innovation in smart homes, smart factories, smart cities and across many emerging industrial and IoT edge applications. The portfolio includes four series of devices built on a common platform and is supported by the widely adopted MCUXpresso suite of development tools and software. This combined offering allows developers to maximize software reuse across the portfolio to speed development. The portfolio also features the first instantiation of NXP’s new, specialized neural processing unit (NPU) for accelerating inference at the edge, delivering up to 30x faster machine learning throughput compared to a CPU core alone. Driven by the proliferation of edge devices, the MCU has evolved dramatically over the last few decades. While they are at the heart of many of today’s edge applications, the next generation of intelligent applications will require a new class of MCUs that allow developers to navigate a complex landscape of power, performance and security requirements, as well as connectivity options, while balancing total system cost and energy efficiency. Built on a common foundation of core technologies and supported by a unified software suite for maximal software reuse, the MCX portfolio will enable the flexibility needed to address this challenge. The breadth of the MCX portfolio allows developers to select devices that best fit their application needs, freeing them to invest in differentiating aspects of their design. The four series in the MCX portfolio are designed for ease of use, to simplify migration and to scale up or down as needed with maximal software reuse to minimize development cost. The portfolio is based on high-performance Arm Cortex-M cores and integrates a comprehensive set of peripherals for design flexibility. MCX devices feature up to 4 MB of on-chip flash memory, low power cache and advanced memory management controllers, plus up to 1MB of on-chip SRAM to further enhance real-time performance of edge applications. Machine learning and run-time inference will be supported by NXP’s eIQ® ML software development environment. Developers can utilize the easy-to-use tools offered by eIQ to train ML models targeting either the NPU or the CPU core and deploy them on the MCU. MCX families that are built following NXP’s security-by-design approach will offer secure boot with an immutable root-of-trust, hardware accelerated cryptography and, on select families, a built-in EdgeLock® secure subsystem. The MCX N Advanced series is designed for secure, intelligent applications, with families that include an integrated EdgeLock secure subsystem and dedicated NPU with a high efficiency compute architecture for real-time inference. The MCX A Essential series is optimized to provide critical functionality for a broad range of applications such as motor control where cost constraints, advanced analog capabilities such as high-precision data converters and fast time to market are key considerations. The MCX W Wireless series offers low-power narrowband connectivity, including Bluetooth Low Energy. Designed to simplify adding wireless connectivity to IoT devices, its energy-efficient radio helps extend the battery life of small connected systems. The MCX L Ultra-Low Power series is designed for power-critical applications. With one of the industry’s lowest static and dynamic power consumption, these devices will help extend battery life significantly compared to traditional MCUs.

Memfault Announces Collaboration with NXP to Accelerate Development and Improve IoT Products in the Field

2022-06-08 11:59:00

Memfault, Inc. announced a collaboration with NXP® Semiconductors to give device manufacturers in-field device monitoring, iteration, and updating capabilities for faster product development, improved device operation, and reduced direct resource costs. IoT device manufacturers building products based on NXP microcontrollers will have access to Memfault’s device observability platform, enabling them to establish a proactive development approach to root cause and fix bugs before end users detect them. Memfault’s embedded device diagnostics platform solves serviceability challenges via fleet observability, remote debugging and smart firmware over-the-air (OTA) management enabling support and product teams to have deep insights into embedded device performance from a single pane of glass in a cloud-based environment. Engineers building on NXP MCUs will have remote access to debugging information without requiring any user interaction, device RMAs, or on-site visits, and release managers can orchestrate complex OTA updates of firmware in an organized and controlled manner. With this collaboration, embedded developers can deploy Memfault on up to 100 NXP devices for free. By dropping the Memfault SDK into an MCUXpresso IDE project, NXP developers can easily integrate the Memfault SDK into their NXP-based IoT projects with just a few clicks. Memfault is compatible with low power, secure NXP MCUs and all major connectivity protocols, including UWB, Wi-Fi, BT, CAN, etc. Memfault is also compatible with Zephyr® RTOS and non-RTOS firmware projects.

NXP Semiconductors N.V. Presents at Bank of America 2022 Global Technology Conference, Jun-08-2022 11:00 AM

2022-06-06 14:23:00

NXP Semiconductors N.V. Presents at Bank of America 2022 Global Technology Conference, Jun-08-2022 11:00 AM. Venue: Ritz Carlton, San Francisco, California, United States. Speakers: Jeff Palmer, Vice President of Investor Relations, Srinath Rajen, Senior Vice President, Finance.

NXP Semiconductors N.V. Appoints Chunyuan Gu as Non-Executive Director

2022-06-02 13:00:00

NXP Semiconductors N.V. announced that at its AGM held on June 1, 2022, the company has appointed Chunyuan Gu as non-executive director with effect from June 1, 2022. Chunyuan Gu has over 30 years of experience working at ABB Ltd, a global technology leader in electrification and automation serving customers in utility, industry, transportation and infrastructure sectors. Mr. Gu began his career at ABB Corporate Research in Sweden in 1989, and has held various leadership roles in R&D, manufacturing operations and general management. He has held various leadership positions during his tenure including serving as a member of the executive committee and president of the Asia, Middle East and Africa regions. Since 2020, Mr. Gu has been a non-executive director of CLP Holdings Limited, and since 2021, he has served as a senior advisor at Blackstone Ltd.Mr. Gu holds a bachelor of engineering from Shanghai Jiao Tong University and a PhD, school of aeronautics from the Royal Institute of Technology, Stockholm. He is a fellow of IVA, the Royal Swedish Academy of Engineering Sciences.

NXP Semiconductors N.V. Announces Quarterly Dividend, Payable on July 6, 2022

2022-06-02 12:45:00

NXP Semiconductors N.V. announced that its board of directors has approved the payment of an interim dividend. The board of directors has approved the payment of an interim dividend of $0.845 per ordinary share for the second quarter of 2022. The interim dividend will be paid in cash on July 6, 2022 to shareholders of record as of June 15, 2022.

NXP Semiconductors N.V., $ 0.845, Cash Dividend, Jun-14-2022

2022-06-02 00:00:00

NXP Semiconductors N.V., $ 0.845, Cash Dividend, Jun-14-2022

NXP Semiconductors N.V., NXP Tech Days Minneapolis, Jun 02, 2022

2022-05-20 09:45:00

NXP Semiconductors N.V., NXP Tech Days Minneapolis, Jun 02, 2022. Venue: St. Paul, Minnesota, United States.

NXP Semiconductors N.V. Presents at Nasdaq 46th Investor Conference, Jun-14-2022 09:30 AM

2022-05-18 16:23:00

NXP Semiconductors N.V. Presents at Nasdaq 46th Investor Conference, Jun-14-2022 09:30 AM. Venue: The May Fair Hotel, London, United Kingdom.

NXP Semiconductors N.V. Presents at Embedded World 2022, Jun-20-2022

2022-05-16 14:12:00

NXP Semiconductors N.V. Presents at Embedded World 2022, Jun-20-2022 . Venue: The Exhibition Centre Nuremberg, Nürnberg Messe, Nuremberg, Germany.

NXP Semiconductors N.V. has announced a Fixed-Income Offering.

2022-05-12 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Offering. Security Name: Fixed Rate Senior Unsecured Notes Security Type: Corporate Bond/Note (Non Convertible) Security Features: Attached Guarantees/Guaranteed; Callable; Senior; Unsecured Coupon Type: Fixed

NXP Semiconductors N.V. has announced a Fixed-Income Offering.

2022-05-12 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Offering. Security Name: Fixed Rate Senior Unsecured Notes Security Type: Corporate Bond/Note (Non Convertible) Security Features: Attached Guarantees/Guaranteed; Callable; Senior; Unsecured Coupon Type: Fixed

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $499.23 million.

2022-05-12 00:00:00

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $499.23 million. Security Name: 4.400% Senior Unsecured Notes due June 1, 2027 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $500 million Price\Range: 99.846% Discount Per Security: 0.325% Security Features: Attached Guarantees/Guaranteed; Callable; Senior; Unsecured Coupon Type: Fixed

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $997.01 million.

2022-05-12 00:00:00

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $997.01 million. Security Name: 5.000% Senior Unsecured Notes due January 15, 2033 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $1 billion Price\Range: 99.701% Discount Per Security: 0.4% Security Features: Attached Guarantees/Guaranteed; Callable; Senior; Unsecured Coupon Type: Fixed

NXP Semiconductors N.V. Presents at 6th Annual Needham Automotive Tech Conference, Jun-07-2022 09:30 AM

2022-05-04 16:46:00

NXP Semiconductors N.V. Presents at 6th Annual Needham Automotive Tech Conference, Jun-07-2022 09:30 AM.

Tranche Update on NXP Semiconductors N.V. (NasdaqGS:NXPI)'s Equity Buyback Plan announced on March 4, 2021.

2022-05-03 06:05:00

From January 1, 2022 to April 3, 2022, the company has repurchased 2,626,206 shares, representing 0.99% for $546.15 million. With this, the company has completed the repurchase of 17,018,613 shares, representing 6.29% for $3,435.07 million under the buyback announced on March 4, 2021.

Tranche Update on NXP Semiconductors N.V. (NasdaqGS:NXPI)'s Equity Buyback Plan announced on January 31, 2022.

2022-05-03 06:05:00

From January 31, 2022 to April 3, 2022, the company has repurchased 0 shares, representing 0% for $0 million. With this, the company has completed the repurchase of 0 shares, representing 0% for $0 million under the buyback announced on January 31, 2022.

NXP Semiconductors N.V. Provides Earnings Guidance for the Second Quarter of 2022

2022-05-02 20:10:00

NXP Semiconductors N.V. provided earnings guidance for the second quarter of 2022. For the quarter, the company expects GAAP total revenue to be between $3,175 million to $3,375 million. GAAP operating income to be between $847 million to $975 million.

NXP Semiconductors N.V. Presents at an Investor Conference Hosted by The Financial Times Ltd., May-10-2022 11:00 AM

2022-04-29 09:54:00

NXP Semiconductors N.V. Presents at an Investor Conference Hosted by The Financial Times Ltd., May-10-2022 11:00 AM. Speakers: Jens Hinrichsen, Executive Vice President and General Manager of Advanced Analog.

The Financial Times Ltd., Investor Conference, May 09, 2022 through May 13, 2022

2022-04-28 11:26:00

The Financial Times Ltd., Investor Conference, May 09, 2022 through May 13, 2022.

NXP Semiconductors N.V. Presents at Application of ISO 26262 2022, Apr-26-2022 through Apr-28-2022

2022-04-25 15:54:00

NXP Semiconductors N.V. Presents at Application of ISO 26262 2022, Apr-26-2022 through Apr-28-2022. Venue: Hilton Berlin, Berlin, Berlin, Germany. Presentation Date & Speakers: Apr-27-2022, Franck Galtié, Functional Safety Fellow, Central Technical Office.

Automotive IQ, Application of ISO 26262 2022, Apr 26, 2022 through Apr 28, 2022

2022-04-25 12:05:00

Automotive IQ, Application of ISO 26262 2022, Apr 26, 2022 through Apr 28, 2022. Venue: Hilton Berlin, Berlin, Berlin, Germany.

NXP Semiconductors N.V. Presents at Embedded Vision Summit 2022, May-16-2022

2022-04-19 14:15:00

NXP Semiconductors N.V. Presents at Embedded Vision Summit 2022, May-16-2022 . Venue: Santa Clara, California, United States. Speakers: Ali Osman Örs, Director, AI ML Strategy and Technologies, Edge Processing, Srikanth Jagannathan, Lead Product Manager.

NXP Semiconductors N.V. Names Jennifer Wuamett as Company’s Chief Sustainability Officer

2022-04-14 18:00:00

NXP Semiconductors N.V. announced that Jennifer Wuamett has been named NXP’s inaugural Chief Sustainability Officer. Ms. Wuamett will continue in her position as executive vice president, general counsel and corporate secretary of NXP in addition to serving in this newly created role. In the role of Chief Sustainability Officer, Ms. Wuamett assumes responsibility for oversight of NXP’s environmental, social and governance (ESG), and risk programs as well as the release of the company’s annual Corporate Sustainability Report. Ms. Wuamett has over two decades of experience in the electronics industry and since 2018 has served as executive vice president, general counsel and corporate secretary of NXP, where she is responsible for worldwide legal, governance, compliance and intellectual property matters. She joined NXP in 2015 with the merger of Freescale to become NXP’s deputy general counsel and chief intellectual property officer. Before joining NXP, she was Freescale’s general counsel and chief intellectual property officer. Prior to joining Freescale, Ms. Wuamett worked for Motorola’s legal department starting in 1997 and served in a variety of roles of increasing responsibility, with a focus on intellectual property and complex transactions. Before joining Motorola, Ms. Wuamett was an attorney in private practice. She holds a Juris Doctor (JD) degree from Arizona State University and holds a Bachelor of Arts degree in chemistry and biology from McDaniel College.

NXP Semiconductors N.V. has announced a Fixed-Income Exchange Offer.

2022-04-14 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Exchange Offer. Security Name: 4.875% Senior Notes due March 01, 2024 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $1 billion Security Features: Attached Guarantees/Guaranteed; Callable; Senior Coupon Type: Fixed Security Name: 5.350% Senior Notes due March 01, 2026 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $500 million Security Features: Attached Guarantees/Guaranteed; Callable; Senior Coupon Type: Fixed Security Name: 5.550% Senior Notes due December 01, 2028 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $500 million Security Features: Attached Guarantees/Guaranteed; Callable; Senior Coupon Type: Fixed Transaction Features: Exchange Offer

NXP Semiconductors N.V., Annual General Meeting, Jun 01, 2022

2022-04-11 20:01:00

NXP Semiconductors N.V., Annual General Meeting, Jun 01, 2022, at 09:00 Central European Standard Time. Location: Head Office of the Company, High Tech Campus 60, 5656 AG, Eindhoven, Netherlands Eindhoven Netherlands Agenda: To discuss Adoption of the 2021 statutory annual accounts; to Discharge the members of the Company's Board of Directors (the Board ) for their responsibilities in the financial year ended December 31,2021;to discuss Re-appointment of nine current directors and appointment of one new director named in this proxy statement;to discuss Authorization of the Board to issue ordinary shares of the Company ( ordinary shares ) and grant rights to acquire ordinary shares; and others subject matters.

NXP Semiconductors N.V. to Report Q1, 2022 Results on May 02, 2022

2022-04-11 14:14:00

NXP Semiconductors N.V. announced that they will report Q1, 2022 results After-Market on May 02, 2022

NXP Semiconductors N.V., Q1 2022 Earnings Call, May 03, 2022

2022-04-11 14:14:00

NXP Semiconductors N.V., Q1 2022 Earnings Call, May 03, 2022

Needham & Company, LLC, 6th Annual Needham Automotive Tech Conference, Jun 07, 2022

2022-04-05 06:13:00

Needham & Company, LLC, 6th Annual Needham Automotive Tech Conference, Jun 07, 2022.

Bank of America Corporation, Bank of America 2022 Global Technology Conference, Jun 07, 2022 through Jun 09, 2022

2022-03-17 14:07:00

Bank of America Corporation, Bank of America 2022 Global Technology Conference, Jun 07, 2022 through Jun 09, 2022. Venue: Ritz Carlton, San Francisco, California, United States.

NXP Semiconductors N.V. Presents at DesignCon 2022, Apr-06-2022 03:00 PM

2022-02-28 01:48:00

NXP Semiconductors N.V. Presents at DesignCon 2022, Apr-06-2022 03:00 PM. Venue: Santa Clara Convention Center, Santa Clara, California, United States. Speakers: Ranjan Sahoo, Circuit and System Architect.

Nasdaq, Inc., Nasdaq 46th Investor Conference, Jun 14, 2022

2022-02-23 11:17:00

Nasdaq, Inc., Nasdaq 46th Investor Conference, Jun 14, 2022. Venue: The May Fair Hotel, London, United Kingdom.

NXP Semiconductors N.V. Presents at J.P. Morgan’s 50th Annual Global Technology, Media and Communications Conference 2022, May-24-2022 02:10 PM

2022-02-08 15:56:00

NXP Semiconductors N.V. Presents at J.P. Morgan’s 50th Annual Global Technology, Media and Communications Conference 2022, May-24-2022 02:10 PM. Venue: Westin Boston Seaport District, Boston, Massachusetts, United States. Speakers: William J. Betz, Executive VP & CFO.

NürnbergMesse GmbH, Embedded World 2022, Jun 20, 2022 through Jun 23, 2022

2022-02-08 00:00:00

NürnbergMesse GmbH, Embedded World 2022, Jun 20, 2022 through Jun 23, 2022. Venue: The Exhibition Centre Nuremberg, Nürnberg Messe, Nuremberg, Germany.

Edge AI, LLC, Vision Alliance L.P., Embedded Vision Summit 2022, May 16, 2022 through May 19, 2022

2022-02-02 11:58:00

Edge AI, LLC, Vision Alliance L.P., Embedded Vision Summit 2022, May 16, 2022 through May 19, 2022. Venue: Santa Clara, California, United States.

Tranche Update on NXP Semiconductors N.V. (NasdaqGS:NXPI)'s Equity Buyback Plan announced on March 4, 2021.

2022-02-01 06:11:00

From October 4, 2021 to December 31, 2021, the company has repurchased 3,022,574 shares, representing 1.13% for $629.69 million. With this, the company has completed the repurchase of 14,392,407 shares, representing 5.3% for $2,888.92 million under the buyback announced on March 4, 2021.

NXP Semiconductors N.V. (NasdaqGS:NXPI) announces an Equity Buyback for $2,000 million worth of its shares.

2022-01-31 21:13:00

NXP Semiconductors N.V. (NasdaqGS:NXPI) announces a share repurchase program. Under the program, the company will repurchase up to $2,000 million worth of shares.

NXP Semiconductors N.V. Approves Interim Dividend for the Fourth Quarter of 2021, Payable on April 6, 2022

2022-01-31 21:13:00

On January 31, 2022, the NXP Semiconductors N.V.'s Board of Directors approved a 50% increase in the quarterly cash dividend to $0.845 per ordinary share. The interim dividend will be paid in cash on April 6, 2022 to shareholders of record as of March 15, 2022.

NXP Semiconductors N.V. Provides Earnings Guidance for the First Quarter of 2022

2022-01-31 21:13:00

NXP Semiconductors N.V. provided earnings guidance for the first quarter of 2022. For the quarter, the company expects total revenue to be $3,025 million to $3,175 million with mid of range of $3,100 million and operating income to be $785 million to $883 million with mid of range of $834 million.

NXP Semiconductors N.V. authorizes a Buyback Plan.

2022-01-31 00:00:00

The Board of Directors of NXP Semiconductors N.V. has authorized a buyback plan on January 31, 2022.

Informa Markets Limited, DesignCon 2022, Apr 05, 2022 through Apr 07, 2022

2022-01-24 17:51:00

Informa Markets Limited, DesignCon 2022, Apr 05, 2022 through Apr 07, 2022. Venue: Santa Clara Convention Center, Santa Clara, California, United States.

NXP Semiconductors N.V. Presents at COMPUTEX 2022, May-23-2022 through May-27-2022

2022-01-20 09:26:00

NXP Semiconductors N.V. Presents at COMPUTEX 2022, May-23-2022 through May-27-2022. Venue: Taipei Nangang Exhibition Center Hall 1 & 2, Taipei, Taiwan. Presentation Date & Speakers: May-24-2022, Kurt Sievers, President, CEO & Executive Director. May-26-2022.

NXP Semiconductors N.V. to Report Q4, 2021 Results on Jan 31, 2022

2022-01-07 17:09:00

NXP Semiconductors N.V. announced that they will report Q4, 2021 results After-Market on Jan 31, 2022

NXP Semiconductors N.V., Q4 2021 Earnings Call, Feb 01, 2022

2022-01-07 17:09:00

NXP Semiconductors N.V., Q4 2021 Earnings Call, Feb 01, 2022

Nxp Semiconductors N.V. Ramps Flagship 4D Imaging Radar Chip to Production, Adds New Product Tailored for Fast-Growing L2+ Market

2022-01-04 17:00:00

NXP Semiconductors N.V. announced two updates to its industry leading automotive radar portfolio, now designed-in at 20 top global OEMs. The industry’s first dedicated 16nm imaging radar processor, the NXP S32R45, has been released into mass production, with initial customer ramp-up starting in the first half 2022. Additionally, the new NXP S32R41 has been introduced to extend 4D imaging radar’s benefits to a much larger number of vehicles. Together these processors serve the L2+ through L5 autonomy sectors, enabling 4D imaging radar for 360-degree surround sensing.

NXP Advances IoT Connectivity with Industry’s First Secure Tri-Radio Device

2022-01-04 17:00:00

NXP Semiconductors N.V. announced the IW612, the industry’s first secure tri-radio device to support the Wi-Fi 6, Bluetooth 5.2 and 802.15.4 protocols. Part of NXP’s new family of tri-radio products, the new device enables seamless, secure connectivity for smart home, automotive and industrial use cases, and supports the new Matter connectivity protocol. The IW612 frees consumers from the restrictions of single protocol ecosystems, allowing them to enjoy seamless interoperability across different ecosystems and wireless network technologies. Additionally, developers benefit from NXP’s coexistence capability, which enables simultaneous support of three radios on a single device, reducing costs and development time. One of the primary challenges facing the IoT is limited interoperability, which can restrict the consumer’s ability to mix smart home products from different companies. Matter, a new standardized IoT connectivity protocol, designed by a consortium of industry leaders including NXP, addresses these limitations by unifying how devices communicate, independent of the manufacturer or wireless technology. The protocol creates more connections between more objects, thereby simplifying development for manufacturers and compatibility for consumers. To support a new era of interoperability, the IW612 integrates three of the industry’s leading connectivity radios onto a single device for the first time, delivering robust radio performance and integrating a high-performance RF front end. This technology combination enables true interoperability in the smart home, significantly reducing development time, simplifying design and reducing costs. The highly integrated solution overcomes hardware co-existence challenges that developers face today, while also enabling advanced security protocols to help thwart the ever-increasing number of security threats faced by the IoT. The IW612 leverages NXP’s long history of leadership in providing secure solutions to help combat the ongoing security threats smart devices face. The IW612 offers secure boot, debug and over-the-air firmware updates for ongoing protection, as well as WPA3 security and hardware encryption engines.

JPMorgan Chase & Co., J.P. Morgan’s 50th Annual Global Technology, Media and Communications Conference 2022, May 23, 2022 through May 25, 2022

2021-12-21 09:47:00

JPMorgan Chase & Co., J.P. Morgan’s 50th Annual Global Technology, Media and Communications Conference 2022, May 23, 2022 through May 25, 2022. Venue: Westin Boston Seaport District, Boston, Massachusetts, United States.

Quest Global Partners with NXP Semiconductors to Deliver Integrated and Secure Platforms for Vehicle Networking

2021-12-21 00:01:00

QuEST Global announced its partnership with NXP Semiconductors to deliver software support for NXP's S32G Vehicle Network Processors. QuEST will provide valued services to help OEM's and Tier-1's unlock the true potential of the NXP S32G processors to deliver a highly-secure vehicle network that combines ASIL D safety, hardware security, high-performance real-time application processing and network acceleration for service-oriented gateways, domain controllers, zonal processors and safety processors. Through this collaboration with NXP, QuEST reaffirms its commitment in helping its partners build safer, greener and smarter future cars.  The evolution in automotive industry has shifted the demand towards electric, autonomous, connected and shared mobility. Vehicles are becoming more data-driven and software-defined, and safe and secure connectivity is becoming a key concern for the consumer. The S32G processor significantly helps in addressing the vehicle networking requirements by securely managing data transmission around the vehicle and protecting safety critical applications. With its trained and dedicated resources specialized on this platform, QuEST will support NXP S32G customers to help reduce development complexity, accelerate time-to-market and expand business opportunities for future data-driven and software-defined Automotive OEMs. NXP's S32G automotive network processors enable modern service-oriented gateways for rapid Over-the-Air (OTA) deployment of new capabilities and advanced edge-to-cloud analytics. They deliver higher processing and networking performance with ASIL D functional safety to support autonomous driving applications. QuEST will be offering the following services for the S32G platform: Hardware System Designing and Prototyping; Automotive System Software Engineering including Design, Development and Maintenance; Integration of Connectivity Module and Features; Support NXP's customers in achieving Functional Safety, System Validation and Automation; and Product Realization.

NXP Semiconductors N.V. and Foxconn Industrial Internet Ltd. Announce Strategic Partnership to Accelerate Automotive Innovation

2021-12-16 09:12:00

NXP Semiconductors N.V. has announced a strategic partnership with Foxconn Industrial Internet Ltd. to transform the car into the ultimate edge device. NXP will provide FII with its comprehensive portfolio of automotive technologies. The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable leading global automotive OEMs and Tier Ones to deliver vivid in-vehicle experiences for their customers. The digital cockpit solution is expected to start mass production in 2023. The companies aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP’s leading radar solutions.

NXP Semiconductors N.V. Presents at Barclays Global TMT Conference 2021, Dec-07-2021 06:45 AM

2021-12-03 02:52:00

NXP Semiconductors N.V. Presents at Barclays Global TMT Conference 2021, Dec-07-2021 06:45 AM.

NXP Semiconductors N.V. Presents at Raymond James Virtual Technology Investors Conference 2021, Dec-06-2021 09:40 AM

2021-12-02 15:23:00

NXP Semiconductors N.V. Presents at Raymond James Virtual Technology Investors Conference 2021, Dec-06-2021 09:40 AM.

NXP B.V., NXP Funding LLC, NXP USA, Inc. and NXP Semiconductors N.V. Completes Private Placement of 2.650% Senior Notes Due 2032, 3.125% Senior Notes Due 2042 and 3.250% Senior Notes Due 2051

2021-11-30 21:41:00

On November 30, 2021, NXP B.V., NXP Funding LLC, NXP USA, Inc. (the issuers) and NXP Semiconductors N.V. completed a private placement of $1,000,000,000 aggregate principal amount of 2.650% Senior Notes due 2032, $500,000,000 aggregate principal amount of 3.125% Senior Notes due 2042 and $500,000,000 aggregate principal amount of 3.250% Senior Notes due 2051 to persons reasonably believed to be qualified institutional buyers pursuant to Rule 144A under the Securities Act of 1933, as amended, and to certain non-U.S. persons in offshore transactions outside of the United States in reliance on Regulation S under the Securities Act. The company and the issuers intend to use a portion of the net proceeds of the Notes to redeem the $1,000,000,000 aggregate principal amount of outstanding dollar-denominated 3.875% senior unsecured notes due 2022 in accordance with the terms of the indenture governing the 3.875% 2022 Notes, including all premiums, accrued interest and costs and expenses related to the 3.875% 2022 Notes Redemption. The company intends to use the remaining net proceeds for general corporate purposes, which may include capital expenditures or equity buyback transactions. The Notes were issued pursuant to an indenture, dated as of November 30, 2021, among the issuers, the company, as guarantor and Deutsche Bank Trust Company Americas, as trustee (the indenture). Interest is payable on the 2032 Notes semi-annually in arrears at an annual rate of 2.650% on February 15 and August 15 of each year, beginning on February 15, 2022. The 2032 Notes will mature on February 15, 2032. Interest is payable on the 2042 Notes semi-annually in arrears at an annual rate of 3.125% on February 15 and August 15 of each year, beginning on February 15, 2022. The 2042 Notes will mature on February 15, 2042. Interest is payable on the 2051 Notes semi-annually in arrears at an annual rate of 3.250% on May 30 and November 30 of each year, beginning on May 30, 2022. The 2051 Notes will mature on November 30, 2051. At any time prior to November 15, 2031 (the date three months prior to the maturity of the 2032 Notes) for the 2032 Notes, August 15, 2041 (the date six months prior to the maturity of the 2042 Notes) for the 2042 Notes, and May 30, 2051 (the date six months prior to the maturity of the 2051 Notes) (collectively, the Redemption Dates), the issuers may redeem the applicable series of Notes, in whole or in part, at a price equal to the greater of 100% of the principal amount of the Notes redeemed and the sum of the present values of the remaining scheduled payments of principal and interest to the applicable Redemption Date, plus, in each case, any accrued and unpaid interest thereon. The Issuers may redeem a series of Notes, in whole or in part, at any time on or after the applicable Redemption Date for such series of Notes at a redemption price of 100% of the principal amount of the Notes being redeemed plus accrued and unpaid interest, if any, to, but excluding, the Redemption Date. If the Issuers experience specific kinds of changes of control, they will be required to offer to purchase each series of the Notes at a purchase price equal to 101% of the principal amount, plus accrued and unpaid interest. The Notes will be senior unsecured obligations of the Issuers and will be guaranteed by the Company on a senior unsecured basis. The Notes and the Guarantee will rank equal in right of payment with all of the Issuers’ and Company’s existing and future senior unsecured indebtedness, but will be effectively junior to all of the Issuers’ and the Company’s future secured indebtedness to the extent of the value of the assets securing such indebtedness and effectively junior in certain circumstances to indebtedness incurred under NXP B.V. and NXP Funding LLC’s Revolving Credit Facility with respect to certain assets of NXP B.V. and its subsidiaries in the event that such assets may secure such indebtedness in the future. The Notes and the Guarantee will rank senior in right of payment to the Issuers’ and the Company’s existing and future subordinated indebtedness and will be structurally subordinated to all of the liabilities, including trade payables, of their subsidiaries. The Indenture provides for customary events of default, including failure to make required payments; failure to comply with certain agreements or covenants; failure to pay, or acceleration of, certain other material indebtedness; certain events of bankruptcy and insolvency; and failure to pay certain judgments. An event of default under the Indenture will allow either the Trustee or the holders of at least 30% in principal amount of the then outstanding Notes to accelerate the amounts due under the Notes.

Nxp Semiconductors N.V. Announces Quarterly Dividend, Paid in Cash on January 6, 2022

2021-11-18 21:05:00

NXP Semiconductors N.V. announced that its board of directors has approved the payment of an interim dividend. The actions are based on the continued and significant strength of the NXP capital structure, and the board’s confidence in the company’s ability to drive long-term growth and strong cash flow. The board of directors has approved the payment of an interim dividend of $0.5625 per ordinary share for the fourth quarter of 2021. The interim dividend will be paid in cash on January 6, 2022 to shareholders of record as of December 15, 2021.

NXP Semiconductors N.V., $ 0.5625, Cash Dividend, Dec-14-2021

2021-11-18 00:00:00

NXP Semiconductors N.V., $ 0.5625, Cash Dividend, Dec-14-2021

Real-Time Innovations, Inc., RTI Automotive Forum, Nov 18, 2021

2021-11-16 13:00:00

Real-Time Innovations, Inc., RTI Automotive Forum, Nov 18, 2021.

NXP Semiconductors N.V. Presents at RTI Automotive Forum, Nov-18-2021

2021-11-16 13:00:00

NXP Semiconductors N.V. Presents at RTI Automotive Forum, Nov-18-2021 . Speakers: Bart Vermeulen, Technical Director.

NXP Semiconductors N.V. Announces Pricing of A Private Offering of Senior Unsecured Notes

2021-11-15 22:28:00

NXP Semiconductors N.V. (together with its subsidiaries, “NXP”) announced the launch and pricing of a private offering of senior unsecured notes pursuant to Rule 144A and Regulation S under the U.S. Securities Act of 1933, as amended, of $1,000 million aggregate principal amount of 2.650% senior notes due 2032, $500 million aggregate principal amount of 3.125% senior notes due 2042 and $500 million aggregate principal amount of 3.250% senior notes due 2051 (collectively, the “Notes”) by its subsidiaries NXP B.V., NXP Funding LLC and NXP USA Inc. (together, the “Issuers”). The Notes will be fully and unconditionally guaranteed on a senior basis by NXP Semiconductors N.V. NXP intends to use a portion of the net proceeds from the offering of the Notes to redeem the $1,000 million aggregate principal amount of outstanding dollar-denominated 3.875% senior unsecured notes due 2022 (the “3.875% 2022 Notes”) in accordance with the terms of the indenture governing the 3.875% 2022 Notes (the “3.875% 2022 Notes Redemption”), including all premiums, accrued interest and costs and expenses related to the 3.875% 2022 Notes Redemption. NXP intends to use the remaining net proceeds for general corporate purposes, which may include capital expenditures or equity buyback transactions. The offering of the Notes is expected to close on November 30, 2021, subject to customary closing conditions.

NXP Semiconductors N.V. has announced a Fixed-Income Offering.

2021-11-15 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Offering. Security Name: Senior Unsecured Notes Security Type: Corporate Bond/Note (Non Convertible) Security Features: Attached Guarantees/Guaranteed; EuroBonds; Eurodollar bonds; Senior; Unsecured Transaction Features: Regulation S; Rule 144A

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

2021-11-15 00:00:00

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

2021-11-15 00:00:00

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

2021-11-15 00:00:00

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $997.53 million Fixed-Income Offering.

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $997.53 million.

2021-11-15 00:00:00

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $997.53 million. Security Name: 2.65% Senior Unsecured Notes due February 15, 2032 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $1 billion Price\Range: 99.753% Security Features: Attached Guarantees/Guaranteed; Callable; EuroBonds; Eurodollar bonds; Senior; Unsecured Coupon Type: Fixed Transaction Features: Regulation S; Rule 144A

NXP Semiconductors N.V. has announced a Fixed-Income Offering.

2021-11-15 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Offering. Security Name: Senior Unsecured Notes Security Type: Corporate Bond/Note (Non Convertible) Security Features: Attached Guarantees/Guaranteed; EuroBonds; Eurodollar bonds; Senior; Unsecured Transaction Features: Regulation S; Rule 144A

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $494.54 million.

2021-11-15 00:00:00

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $494.54 million. Security Name: 3.125% Senior Unsecured Notes due February 15, 2042 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $500 million Price\Range: 98.908% Security Features: Attached Guarantees/Guaranteed; Callable; EuroBonds; Eurodollar bonds; Senior; Unsecured Coupon Type: Fixed Transaction Features: Regulation S; Rule 144A

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

2021-11-15 00:00:00

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

2021-11-15 00:00:00

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

2021-11-15 00:00:00

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $494.54 million Fixed-Income Offering.

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

2021-11-15 00:00:00

Bank Of America Merrill Lynch has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

2021-11-15 00:00:00

Deutsche Bank Aktiengesellschaft has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

2021-11-15 00:00:00

Morgan Stanley has been added as the Co-Lead Underwriter for NXP Semiconductors N.V.'s $493.85 million Fixed-Income Offering.

NXP Semiconductors N.V. has announced a Fixed-Income Offering.

2021-11-15 00:00:00

NXP Semiconductors N.V. has announced a Fixed-Income Offering. Security Name: Senior Unsecured Notes Security Type: Corporate Bond/Note (Non Convertible) Security Features: Attached Guarantees/Guaranteed; EuroBonds; Eurodollar bonds; Senior; Unsecured Transaction Features: Regulation S; Rule 144A

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $493.85 million.

2021-11-15 00:00:00

NXP Semiconductors N.V. has completed a Fixed-Income Offering in the amount of $493.85 million. Security Name: 3.25% Senior Unsecured Notes due November 30, 2051 Security Type: Corporate Bond/Note (Non Convertible) Principal Amount: $500 million Price\Range: 98.77% Security Features: Attached Guarantees/Guaranteed; Callable; EuroBonds; Eurodollar bonds; Senior; Unsecured Coupon Type: Fixed Transaction Features: Regulation S; Rule 144A

NXP Semiconductors N.V. Presents at Edge AI Summit, Nov-15-2021

2021-11-11 19:16:00

NXP Semiconductors N.V. Presents at Edge AI Summit, Nov-15-2021 . Speakers: Ali Ors, AI Technologies and Strategies Lead.

Kisaco Research, Edge AI Summit, Nov 15, 2021 through Nov 18, 2021

2021-11-11 17:56:00

Kisaco Research, Edge AI Summit, Nov 15, 2021 through Nov 18, 2021.

NXP Semiconductors and Ford Motor Company Collaborate to Deliver Next-Generation Connected Car Experiences and Expanded Services

2021-11-10 09:00:00

NXP Semiconductors announced a collaboration with the Ford Motor Company to deliver enhanced driver experiences, convenience and services across its global fleet of vehicles, including the 2021 Ford F-150 pickup, Mustang Mach-E and Bronco SUVs. Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX 8 Series processors, working together to upgrade vehicles that help improve customer lifestyle and streamline the ownership experience. NXP’s vehicle network processors provide secure, in-vehicle networking and enable the gateway to rapidly deploy Over-the-Air (OTA) software updates and new services, while processing and sending deep vehicle data to the cloud to drive continual product improvements and support data-driven services like vehicle health management. The NXP i.MX 8 Series processors help enable Ford SYNC®4 to deliver advanced multimedia user experiences with vivid graphics enabling in-car productivity, cloud services, enhanced voice recognition, and location-based applications.

NXP Semiconductors Announces i.MX 93 Applications Processor Family Powers A New Era of Secure Edge Intelligence

2021-11-09 08:00:00

NXP Semiconductors announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart factory applications, which leverage edge machine learning to anticipate and automate based on user needs. As the first applications processors in NXP’s i.MX 9 series, the new i.MX 93 family combines the industry’s first implementation of the Arm Ethos-U65 microNPU with security and a high degree of integration to deliver efficient, fast, secure machine learning at the edge. These family attributes enable developers to address diverse areas, from voice-assisted smart home and building systems, to low-power industrial gateways and automotive driver monitoring systems. Systems that can process system inputs to make intelligent decisions locally with a high degree of accuracy are essential for the growth of the edge. To take on these challenges, the i.MX 93 family leverages a heterogenous multi-core architecture, including up to 2x 1.7 GHz Arm Cortex®-A55 applications processors and a real-time Cortex-M33 microcontroller sub-system with full access to all SoC peripherals, including the industry’s first implementation of a 256 MACs/cycles Arm Ethos-U65 microNPU. This architecture delivers best-in-class, power-efficient machine learning performance across a variety of applications, including compact, battery-powered IoT devices, which require highly capable and efficient processors to maintain a longer battery life. The i.MX 93 family is highly integrated, supporting a wide variety of industrial and automotive connectivity interface protocols, in addition to broad multi-media interfaces. This makes it easier for designers to connect the i.MX 93 devices across multiple systems. It also reduces the need for external hardware components and additional design work, decreasing time to market and reducing overall systems costs. NXP’s EdgeLock® secure enclave, a preconfigured, self-managed and autonomous security subsystem, is a standard on-die feature across the i.MX 9 series, enabling developers to achieve their device security goals without requiring deep security expertise. Keeping edge devices secured long after initial deployment is a challenge that requires the help of nonstop trusted management services. NXP has partnered with Microsoft to offer customers a comprehensive chip-to-cloud security solution and more than ten years of ongoing updates and security improvements with the “cloud secured” i.MX 93-CS family built with Microsoft Azure Sphere. i.MX 93-CS processors with Azure Sphere are built with Microsoft Pluton enabled on the EdgeLock secure enclave. Pluton on EdgeLock secure enclave is the dependable hardware root of trust – built into the silicon – that enables the full Azure Sphere security stack and lays the foundation for developing highly secured devices for a multitude of IoT and industrial applications. Machine learning application development on the i.MX 93 family will be enabled by the eIQ® software development environment, including the eIQ Toolkit workflow tools, the GUI-based eIQ Portal development environment and eIQ inference engine options that will include the Arm Ethos-U65 microNPU as an inference target. The i.MX 93 applications processors implement NXP’s innovative Energy Flex architecture, enabling developers to optimize energy usage for each operating mode to create portable devices with longer battery life and to help reduce the carbon footprint of mains-powered equipment. The i.MX 93 family will be part of NXP’s Product Longevity program.

NXP Semiconductors N.V. Provides Earnings Guidance for the Fourth Quarter of 2021

2021-11-02 11:42:00

NXP Semiconductors N.V. provided earnings guidance for the fourth quarter of 2021. For the quarter, the company expects total revenue to be $2,925 million to $3,075 million and operating income to be $710 million to $805 million.

Tranche Update on NXP Semiconductors N.V. (NasdaqGS:NXPI)'s Equity Buyback Plan announced on March 4, 2021.

2021-11-02 07:42:00

From July 5, 2021 to October 3, 2021, the company has repurchased 5,037,477 shares, representing 1.87% for $1,004.32 million. With this, the company has completed the repurchase of 11,369,833 shares, representing 4.16% for $2,259.23 million under the buyback announced on March 4, 2021.

Metanoia and NXP Collaborate to Deliver a Complete 5G NR Sub-6Ghz Platform

2021-10-25 04:01:00

Metanoia Communications ("Metanoia") announced its collaboration with NXP® Semiconductors for the development of a new 5G NR Sub-6GHz demonstration/development platform (Reference Platform) that combines innovative technologies from both companies. The new Reference Platform leverages NXP's high performance Layerscape® family of multicore processors and 5G NR programable baseband processors and Metanoia's recently announced 5G NR Sub-6Ghz RF IC (MT3812). The Reference Platform will facilitate and reduce considerably customers' design cycle building a 5G Sub-6GHz solution addressing all 5G market segments – from a single FWA CPE to low or high density 5G Remote Radio Units (RRUs), and to highly integrated Small-Cells. Targeting the high volume, highly popular mid-band (3.3 GHz – 4.2 GHz (n77), the complete 5G NR Reference Platform enables the development of Software Defined Radio (SDR) solutions with support for i) L1 PHY implementations, ii) a wide range of DPD/CFR performance, iii) networking offload for timing, parsing and Quality of Service (QoS), iv) offload for eCPRI C/U- and S-Plane including virtualized and containerized L2 applications. Evaluating lower and higher frequency bands, supported by the Metanoia MT3812, will also be possible by by-passing appropriate RF front end components, like a Power Amplifier and Low Noise Amplifier on the Reference Platform. Metanoia's MT3812 is a cost-effective Sub 6Ghz TDD 2x2 RF transceiver with a tiny 9x9 mm QFN68 footprint, which supports 200 MHz Bandwidth in Transmit and Receive modes, and 400 MHz in DPD mode. It is a highly integrated multi-band programmable and self-calibrated product supporting three of the most popular bands: 2.5 GHz – 3.0 GHz (n90), 3.3 GHz – 4.2 GHz (n77), and 4.2 GHz – 5.0 GHz (n79). MT3812 is designed to interface with any I/Q baseband chip and includes distinguishing features such as high dynamic range on its low noise receive chains and high linearity and low noise floor on its transmit chains.

NXP Semiconductors N.V. to Report Q3, 2021 Results on Nov 01, 2021

2021-10-14 20:05:00

NXP Semiconductors N.V. announced that they will report Q3, 2021 results After-Market on Nov 01, 2021

NXP Semiconductors N.V., Q3 2021 Earnings Call, Nov 02, 2021

2021-10-14 20:05:00

NXP Semiconductors N.V., Q3 2021 Earnings Call, Nov 02, 2021

NXP Semiconductors N.V. Names Bill Betz as Executive Vice President

2021-10-12 20:15:00

NXP Semiconductors N.V. announced that Bill Betz has been named NXP’s Executive Vice President, effective immediately. Betz, formerly Senior Vice President, Business Finance for NXP, replaces Peter Kelly, who – as announced this February – has decided to retire from NXP. Betz will report directly to NXP President and Chief Executive Officer Kurt Sievers.

NXP Semiconductors N.V. Names Bill Betz as Chief Financial Officer

2021-10-12 20:15:00

NXP Semiconductors N.V. announced that Bill Betz has been named NXP’s Chief Financial Officer, effective immediately. Betz, formerly Senior Vice President, Business Finance for NXP, replaces Peter Kelly, who – as announced this February – has decided to retire from NXP. Betz will report directly to NXP President and Chief Executive Officer Kurt Sievers.

Computex, Taiwan External Trade Development Council, Taipei Computer Association, COMPUTEX 2022, May 23, 2022 through May 27, 2022

2021-10-06 07:37:00

Computex, Taiwan External Trade Development Council, Taipei Computer Association, COMPUTEX 2022, May 23, 2022 through May 27, 2022. Venue: Taipei Nangang Exhibition Center Hall 1 & 2, Taipei, Taiwan.

NXP and Partners Test Advanced V2X Application Scenarios for Collision-Free Driving

2021-10-06 07:00:00

NXP® Semiconductors has announced that it will showcase new safety scenarios enabled by vehicle-to-vehicle communication (Vehicle-to-X or V2X) as part of this year’s ITS World Congress in Hamburg. NXP will work together with partners such as premium manufacturer Riese & Müller, to highlight better protection for vulnerable road users, new V2X application scenarios designed to help prevent traffic accidents and e-bike safety demonstrations. NXP's V2X technology is based on 802.11p, a communication standard also known as DSRC (Dedicated Short-Range Communication). Optimized for automobiles, 802.11p allows vehicles, road infrastructure and other road users to exchange information in real time. Every year, more than 1.3 million people are killed in road accidents across the world and more than 50% of the fatalities are cyclists, pedestrians and motorcyclists. Technologies such as V2X and driver assistance systems can make a significant contribution to help reduce these numbers and are already in standard use in selected passenger car models. To demonstrate how the safety of road users can be enhanced, NXP and Riese & Müller have built a smart electric bicycle prototype. The demonstration combines NXP’s RoadLINK ® automotive-qualified DSRC modem and Hardware Secure Element IC for V2X applications, with the Cohda Wireless’ On–Board Unit. The configuration enables the e-bike to transmit data on its position, speed and direction of travel to other V2X-enabled vehicles in the vicinity that could pose a potential danger to the cyclist. The module calculates the distances between road users and position changes within seconds. In the event of a dangerous situation, both the cyclist and a car’s driver, would receive a timely collision warning.

NXP Semiconductors N.V. Presents at Credit Suisse 25th Annual Technology Conference, Dec-01-2021 08:45 AM

2021-10-05 09:20:00

NXP Semiconductors N.V. Presents at Credit Suisse 25th Annual Technology Conference, Dec-01-2021 08:45 AM. Venue: The Phoenician Hotel, Scottsdale, Arizona, United States. Speakers: Bill Betz, SVP Finance, Peter Kelly, CFO, Executive VP of Strategy, M&A and Integration.

NXP Semiconductors N.V. - Analyst/Investor Day

2021-10-04 20:00:00

NXP Semiconductors N.V. - Analyst/Investor Day

NXP Trimension™ Ultra-Wideband Technology Powers Xiaomi Mix4 Smartphone to Deliver New “Point to Connect” Smart Home Solution

2021-09-27 01:00:00

NXP Semiconductors announced that its Trimension Ultra-Wideband (UWB) solution powers new “Point to connect” capabilities in Xiaomi’s latest phone, the Xiaomi MIX4. UWB delivers new levels of smart home convenience through the rapid and accurate connection of the smartphone to select devices in the Xiaomi smart home ecosystem, such as Xiaomi Sound Smart speakers and TVs, and opens the door for expanded use cases across the IoT. NXP’s Trimension technology enables the secure ranging and precision sensing for a new dimension of spatial context. This precision is the key to delivering a range of smart connected use cases such as secure hands free access, indoor navigation, hands free payment, and item tracking. The breadth of UWB possibilities extends across mobile, automotive, Internet-of-Things (IoT) and the industrial space and is rooted in NXP’s expertise and standardization efforts in bodies such as the FiRa Consortium and the Car Connectivity Consortium. Xiaomi’s “Point to connect” simplifies the connectivity of select devices in its smart home ecosystem. This creates ultimate control of the smart home environment, like a universal remote control with an intuitive interface.

Raymond James & Associates, Inc., Raymond James Virtual Technology Investors Conference 2021, Dec 06, 2021 through Dec 08, 2021

2021-09-16 22:54:00

Raymond James & Associates, Inc., Raymond James Virtual Technology Investors Conference 2021, Dec 06, 2021 through Dec 08, 2021.

NXP Semiconductors N.V. Presents at IPWatchdog Live 2021, Sep-14-2021 09:45 AM

2021-09-09 02:56:00

NXP Semiconductors N.V. Presents at IPWatchdog Live 2021, Sep-14-2021 09:45 AM. Speakers: CHANGHAE PARK, Senior Vice President and Chief IP Officer.

NXP Semiconductors N.V. Approves Interim Dividend for the Third Quarter of 2021, Payable on October 6, 2021

2021-08-26 20:15:00

On August 26, 2021, the Board of Directors of NXP Semiconductors N.V. approved the payment of an interim dividend for the third quarter of 2021 of $0.5625 per ordinary share. The interim dividend will be paid on October 6, 2021 to shareholders of record as of September 15, 2021.

NXP Semiconductors N.V., $ 0.5625, Cash Dividend, Sep-14-2021

2021-08-26 00:00:00

NXP Semiconductors N.V., $ 0.5625, Cash Dividend, Sep-14-2021

NXP Semiconductors N.V. announces an Increase in Equity Buyback.

2021-08-26 00:00:00

On August 26, 2021, the company announced an increase in its equity buyback plan. The company increased its authorization by $2,000 million, thereby bringing the total authorization to $4,000 million.

IPWatchdog, IPWatchdog Live 2021, Sep 12, 2021 through Sep 14, 2021

2021-08-25 06:29:00

IPWatchdog, IPWatchdog Live 2021, Sep 12, 2021 through Sep 14, 2021.

Samsung Reportedly Rethinking Possible NXP Acquisition

2021-08-22 00:00:00

From that standpoint, investors continue to focus on Samsung Electronics Co., Ltd. (KOSE:A005930) over its intention to purchase NXP Semiconductors N.V. (NasdaqGS:NXPI). But Samsung is coming close to shifting its stance towards the "NXP scenario" as its secondary option rather than a primary one. On August 22, 2021, sources involved with the issue said the South Korean tech behemoth has started rethinking its possible acquisition of NXP. "NXP Semiconductors was one company on Samsung's shopping, but the company is second-guessing its acquisition of NXP because NXP is too big," an industry executive said by telephone. If Samsung acquires NXP, then it can sell vehicle components to its existing clients such as BMW and Ford, but a high price and expected tough antitrust review are cited as the two major points pushing Samsung to reconsider its assessment of taking over NXP, the executive added. Because Samsung has lagged behind in areas such as foundry chip-making, driverless vehicles, 5G and biotech, its recent confirmation that it will try to close "sizable deals" in the next few years raised investors' expectations that Samsung may acquire NXP with JPMorgan recently justifying that scenario. Samsung Electronics' net-cash was some 125 trillion won as of last year, comparable to Apple and Google in terms of cash holdings. "NXP Semiconductors is becoming expensive. The automotive chip industry will further expand, and given NXP's market position, it will be viewed as appropriate for Samsung and actually it could be the right fit to help Samsung fill in its weakness in the contract-chip making and automotive solution businesses, but NXP is too pricey," another executive said. The acquisition price of NXP is estimated at some KRW 80 trillion including an acquisition premium. Samsung considered acquiring NXP back in 2019.

NXP Semiconductors N.V. Presents at Deutsche Bank Technology Conference 2021, Sep-09-2021 through Sep-10-2021

2021-08-17 16:04:00

NXP Semiconductors N.V. Presents at Deutsche Bank Technology Conference 2021, Sep-09-2021 through Sep-10-2021. Presentation Date(s): Sep-09-2021. Sep-10-2021.

NXP Semiconductors N.V. Presents at Evercore ISI Autotech & AI Forum, Sep-22-2021 11:45 AM

2021-08-17 16:04:00

NXP Semiconductors N.V. Presents at Evercore ISI Autotech & AI Forum, Sep-22-2021 11:45 AM.

Tranche Update on NXP Semiconductors N.V. (NasdaqGS:NXPI)'s Equity Buyback Plan announced on March 4, 2021.

2021-08-03 06:06:00

From April 5, 2021 to July 4, 2021, the company has repurchased 6,083,056 shares, representing 2.21% for $1,209.85 million. With this, the company has completed the repurchase of 6,332,356 shares, representing 2.3% for $1,254.91 million under the buyback announced on March 4, 2021.

NXP Semiconductors N.V. Provides Earnings Guidance for the Third Quarter of 2021

2021-08-02 20:05:00

NXP Semiconductors N.V. provided earnings guidance for the third quarter of 2021. For the quarter, the company expects total revenue to be in the range of $2,775 million to $2,925 million. Operating income to be in the range of $650 million to $732 million.

Evercore Inc., Evercore ISI Autotech & AI Forum, Sep 21, 2021

2021-07-28 09:50:00

Evercore Inc., Evercore ISI Autotech & AI Forum, Sep 21, 2021.

NXP Semiconductors N.V. Presents at 22nd Annual KeyBanc Virtual Technology Leadership Forum, Aug-11-2021 01:20 PM

2021-07-27 17:01:00

NXP Semiconductors N.V. Presents at 22nd Annual KeyBanc Virtual Technology Leadership Forum, Aug-11-2021 01:20 PM. Venue: Grand Hyatt, Vail, Colorado, United States.

NXP Semiconductors and MOTER Technologies Join Forces to Extend Connected Vehicle Insurance Opportunities

2021-07-20 07:02:00

NXP Semiconductors N.V. and MOTER Technologies Inc. have announced a secure data exchange platform that links deep data from connected vehicles to the insurance industry to power data science solutions for risk assessment, cost modeling, and more. The platform combines NXP’s S32G2 vehicle network processors, offering a new type of vehicle edge compute with the ability to access vehicle-wide data, with MOTER data analytics software to help fully monetize vehicle data for new and improved automotive insurance services. New vehicle insurance policies driven by telematics data, which have reached penetration rates as much as 30% in some insurance companies,* represent a market that is expected to grow over 27% annually as insurance providers develop new data-driven insurance products. Access to a broader automotive dataset, with more detailed and accurate insights, can enable the development of next-generation analytics tools for actuarial analysis, new mobility product development and claims management. While connected vehicles can generate terabytes of data per hour, some of which can be leveraged for sophisticated underwriting and multiple business applications, carmakers and insurance companies are impeded from a lack of available, cost-effective data processing platforms with sufficient performance, security and centralized access to vehicle-wide data. To meet this need, NXP and MOTER have integrated their offerings into a platform that targets the needs of the automotive and insurance industries. The MOTER platform offers advanced risk algorithms that can be updated over the-air and combined with an insurance carrier’s or mobility company’s custom insurance algorithms to create marketable driver insights. The MOTER platform can be licensed for use with OEM vehicles to facilitate data exchange with insurers and mobility companies who are willing to subscribe and pay for driver insights to enable new vehicle data-driven products, including, but not limited to, usage-based insurance.

NXP Semiconductors N.V. to Report Q2, 2021 Results on Aug 02, 2021

2021-07-08 20:05:00

NXP Semiconductors N.V. announced that they will report Q2, 2021 results After-Market on Aug 02, 2021

NXP Semiconductors N.V., Q2 2021 Earnings Call, Aug 03, 2021

2021-07-08 20:05:00

NXP Semiconductors N.V., Q2 2021 Earnings Call, Aug 03, 2021

NXP Semiconductors N.V. and Jio Platforms Limited Collaborate to Enable Expanded 5G Use Cases in India

2021-06-29 06:00:00

NXP Semiconductors N.V. and Jio Platforms Ltd. a collaboration to implement a 5G NR O-RAN small cell solution that incorporates NXP’s Layerscape® family of multicore processors. The combined solution will power new RAN networks that will deliver high performance, enabling a wide range of 5G use cases for broadband access as well as Industry 4.0 and IoT applications, including tele-medicine, tele-education, augmented/virtual reality, drone-based agricultural monitoring and more. JPL has leveraged the high performance and flexibility of NXP’s Layerscape processors in its new 5G NR solutions. The combination enables a powerful offering that has successfully tested at 100 MHz channel bandwidth in 3.5 GHz spectrum with peak data rates of 1 Gbps+. This translates to increased performance for a wide range of segments, enabling innovative applications in smart cities, smart homes, health and education, and significantly enhanced user experience in data download rates for all mobile users. As a result, JPL’s 5G NR radio solutions are well suited for next generation RAN networks, providing increased indoor and outdoor performance and enabling a wide range of 5G use cases. NXP’s Layerscape® family of multicore processors provides high levels of integration and deliver strong performance leveraging the combination of Arm 64-bit cores, networking and security offload engines with wide high-speed SerDes interfaces for highly integrated system implementation. Hardware networking offload include switching, timing, parsing and Quality of Service (QoS), providing offload for eCPRI C/U- and S-Plane offload including virtualized and containerized L1/L2 applications. The overall system delivers efficient, scalable performance via software programmable implementation. From antenna-to-processor, NXP offers a robust portfolio of technologies for accelerating 5G deployments that delivers best-of-class performance and security for infrastructure, industrial, and automotive applications. This includes the company’s Airfast family of RF power solutions and its Layerscape family of multicore processors for wireless data links, fixed wireless access, and small cell devices.

NXP Brings GaN to 5G Multi-Chip Modules for Energy-Efficient Mobile Networks

2021-06-28 06:00:00

NXP Semiconductors N.V. announced a major industry milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, the most advanced fab dedicated to RF power amplifiers in the United States, NXP is the first to announce RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules. Reducing energy consumption is a major goal for telecom infrastructure, where every point of efficiency counts. The use of GaN in multi-chip modules increases lineup efficiency to 52% at 2.6 GHz "8 percentage points higher than the company’s previous module generation. And NXP has further improved performance with a proprietary combination of LDMOS and GaN in a single device, delivering 400 MHz of instantaneous bandwidth that makes it possible to design wideband radios with a single power amplifier. This energy efficiency and wideband performance are now available in the small footprint of NXP’s 5G multi-chip modules. The new portfolio will enable RF developers to reduce the size and weight of radio units, helping mobile network operators lower the cost of deploying 5G on cellular towers and rooftops. In a single package, the modules integrate a multi-stage transmit chain, 50-ohm in/out matching networks and a Doherty combiner "and NXP is now adding bias control using its latest SiGe technology. This new step in integration removes the need for a separate analog control IC and provides tighter monitoring and optimization of power amplifier performance.