Applied Materials, Inc. (AMAT) Report Analysis
Corporate Events
Applied Materials, Inc. (NasdaqGS : AMAT) acquired Picosun Oy.
2022-06-16 00:00:00
Applied Materials, Inc. (NasdaqGS : AMAT) acquired Picosun Oy on June 16, 2022. The transaction has been approved by the Ministry of Economic Affairs and Employment of Finland; no other regulatory approvals were required. Goldman Sachs & Co. LLC served as financial advisor and Hogan Lovells US LLP served as legal counsel for Applied Materials. Carnegie acted as sole financial adviser to the owners of Picosun Oy in connection with the sale. Applied Materials, Inc. (NasdaqGS : AMAT) completed the acquisition of Picosun Oy on June 16, 2022.
Applied Materials, Inc. Announces Quarterly Cash Dividend, Payable on September 15, 2022
2022-06-09 20:05:00
Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.26 per share payable on the company’s common stock. The dividend is payable on September 15, 2022 to shareholders of record as of August 25, 2022.
Applied Materials, Inc.’s New Ioniq™ PVD System Solves Wiring Resistance Challenges of 2D Scaling
2022-05-26 11:30:00
Applied Materials, Inc. introduced a new system that re-engineers the deposition of transistor wiring to significantly reduce electrical resistance, which has become a critical bottleneck to further improvements in chip performance and power. Chipmakers are using advances in lithography to shrink chips to the 3nm node and beyond. Unfortunately, as the wires become thinner, the electrical resistance increases exponentially, and this reduces chip performance and increases power consumption. If left unchecked, the wiring resistance can fully negate the benefits of more advanced transistors. Chip wiring is deposited into trenches and vias that are etched into a dielectric material. In the conventional approach, the wiring is deposited using a metal stack that typically includes a barrier layer to prevent the metal from mixing with the dielectric; a liner layer to promote adhesion; a seed layer to facilitate metal fill; and a conductive metal like tungsten or cobalt for the transistor contacts and copper for the interconnect wires. The barriers and liners don’t scale well, so as the trenches and vias shrink, the proportion of space available for conductive metals is reduced; and the smaller the wiring, the higher the electrical resistance. The Ioniq PVD system is an Integrated Materials Solution™ (IMS™) that includes surface preparation along with PVD and CVD processes in a single, high-vacuum system. Ioniq PVD enables chipmakers to replace the high-resistance liner and barrier layers, typically made of titanium nitride, with a pure, low-resistance PVD tungsten film which is then combined with CVD tungsten to create a pure tungsten metal contact. The solution solves the resistance challenges and enables 2D scaling to continue to the 3nm node and beyond.
Applied Materials, Inc. Announces Revenue Guidance for the Third Quarter of Fiscal Year 2022
2022-05-19 20:01:00
Applied Materials, Inc. announced revenue guidance for the third quarter of fiscal year 2022. FOr the quarter, the company expected sales to be approximately $6.25 billion, plus or minus $400 million, which includes the expected impact of ongoing supply chain challenges.
Tranche Update on Applied Materials, Inc. (NasdaqGS:AMAT)'s Equity Buyback Plan announced on September 27, 2017.
2022-05-19 16:04:00
From January 31, 2022 to May 1, 2022, the company has repurchased 14,400,000 shares, representing 1.63% for $1,797.7 million. With this, the company has completed the repurchase of 217,378,918 shares, representing 22.56% for $15,061.97 million under the buyback announced on September 27, 2017.
Tranche Update on Applied Materials, Inc. (NasdaqGS:AMAT)'s Equity Buyback Plan announced on March 11, 2022.
2022-05-19 16:04:00
From March 11, 2022 to May 1, 2022, the company has repurchased 0 shares, representing 0% for $0 million. With this, the company has completed the repurchase of 0 shares, representing 0% for $0 million under the buyback announced on March 11, 2022.
Applied Materials, Inc. Presents at Bank of America 2022 Global Technology Conference, Jun-07-2022 10:15 AM
2022-05-19 11:30:00
Applied Materials, Inc. Presents at Bank of America 2022 Global Technology Conference, Jun-07-2022 10:15 AM. Venue: Ritz Carlton, San Francisco, California, United States. Speakers: Brice A. Hill, Senior VP & CFO.
Applied Materials, Inc. Presents at 59th International Display Week Symposium and Seminar/2022 SID/DSCC Business Conference, May-09-2022 08:30 AM
2022-05-09 00:00:00
Applied Materials, Inc. Presents at 59th International Display Week Symposium and Seminar/2022 SID/DSCC Business Conference, May-09-2022 08:30 AM. Venue: San Jose, California, United States. Speakers: Max McDaniel, Vice President Chief Marketing Officer.
Applied Materials, Inc. - Special Call
2022-05-06 21:33:00
To discuss 2022 Master Class Series: New Ways to Wire and Integrate Chips
Applied Materials, Inc. Technologies Enable 2D Scaling with EUV and 3D Gate-All-Around Transistors
2022-04-21 11:30:00
Applied Materials, Inc. introduced innovations that help customers continue 2D scaling with EUV and detailed the industry's broadest portfolio of technologies for manufacturing next-generation 3D Gate-All-Around transistors. Chipmakers are pursuing two complementary paths to increase transistor density in the years ahead. One is classic Moore's Law 2D scaling, creating smaller features using EUV lithography and materials engineering. The other is using design technology cooptimization (DTCO) and 3D techniques that cleverly optimize the layout of logic cells to increase density independent of changes in the lithography pitch. These latter approaches, which include backside power distribution networks and Gate-All-Around (GAA) transistors, are expected to drive a growing proportion of logic density improvements in future years as classic 2D scaling slows. Together, these techniques can help chipmakers as they aim to deliver future generations of logic chips with improved power, performance, area, cost and time-to-market -- or PPACt. Extending 2D Scaling - The emergence of extreme ultraviolet (EUV) lithography has enabled chipmakers to produce smaller features and increase transistor density. However, the industry has reached a point where further scaling with EUV is introducing challenges that require new approaches to deposition, etch and metrology. Following EUV resist development, chip patterns need to be etched through a series of intermediate layers – called the transfer layer and hardmask -- before they are finally etched into the wafer. Until now, these layers have been deposited using spin-on technology. Applied is introducing the Stensar(TM) Advanced Patterning Film for EUV which is deposited using Applied's Precision CVD (chemical vapor deposition) system. Compared to spin-on deposition, Applied's CVD film helps customers tune the EUV hardmask layers for specific thicknesses and etch resiliency so they can achieve near-perfect EUV pattern transfer uniformity across the entire wafer. Applied also detailed a special capability of its Sym3(R) Y etch systems which enables customers to etch and deposit materials in the same chambers to help improve EUV patterns before they are etched into the wafer. The Sym3 chambers gently remove EUV resist materials and then redeposit material in a special way that averages out the pattern variability caused by "stochastic errors." The improved EUV patterns increase yields and improve chip power and performance. As a result, Applied's Sym3 technology is quickly growing beyond memory -- where Applied is the number-one supplier of conductor etch systems to the DRAM market -- to foundry-logic. Applied also demonstrated how its PROVision(R) eBeam metrology technology can be used to see deeply within multilayer chips to precisely measure EUV-patterned features across the entire wafer, helping customers solve "edge placement errors" that other metrology techniques cannot diagnose. Applied nearly doubled its eBeam system revenue in 2021 and has become the number-one supplier of eBeam technology. Engineering 3D Gate-All-Around Transistors The emerging GAA transistor exemplifies how customers can supplement 2D scaling with 3D design techniques and DTCO layout innovations to rapidly increase logic density even as 2D scaling slows. Innovations in materials engineering provide GAA transistors with improvements in power and performance as well. In FinFETs, the vertical channels that form the transistor's electrical path are shaped by lithography and etch, processes that can result in uneven channel widths. The non-uniformity negatively impacts power and performance, which is one of the major reasons customers are moving to GAA. GAA transistors resemble FinFET transistors that have been rotated by 90 degrees so that the channels are horizontal instead of vertical. The GAA channels are formed using epitaxy and selective materials removal, technologies that enable customers to precisely engineer the width and uniformity for optimum power and performance. Applied's first-ever product was an epitaxy system, and the company has been the market leader ever since. Applied pioneered selective materials removal when it launched the Selectra(R) system in 2016 and is the market leader with over 1,000 chambers in use by customers. A major challenge of manufacturing GAA transistors is that the space between the channels is only around 10nm, and customers must deposit the multilayer gate oxide and metal gate stacks around all four sides of the channels in the minute space available. Applied has developed an IMS(TM) (Integrated Materials Solution) system for the gate oxide stack. A thinner gate oxide results in higher drive current and transistor performance. However, thinner gate oxides typically result in higher leakage current that wastes power and creates heat. Applied's new IMS system reduces equivalent oxide thickness by 1.5 angstroms, enabling designers to increase performance with no increase in gate leakage or keep performance constant and reduce gate leakage by more than 10X. It integrates atomic layer deposition (ALD), thermal steps, plasma treatment steps and metrology in a single, high-vacuum system. Applied is also demonstrating an IMS system for engineering GAA metal gate stacks, enabling customers to vary gate thicknesses in order to tune transistor threshold voltages to meet the performance-per-watt goals of specific computing applications ranging from battery-powered mobile devices to high-performance servers. It performs the high-precision metal ALD steps in high vacuum to prevent atmospheric contamination. Additional details about Applied's logic scaling solutions will be provided at the company's "New Ways to Shrink" Master Class being held later on April 21, 2022.
Applied Materials, Inc. - Special Call
2022-04-02 08:32:00
2022 Master Class Series: New Ways to Shrink
Applied Materials, Inc. Presents at Display Week 2022, May-08-2022
2022-03-21 19:22:00
Applied Materials, Inc. Presents at Display Week 2022, May-08-2022 . Venue: San Jose McEnery Convention Center, San Jose, California, United States. Speakers: Max McDaniel, VP and CMO.
Bank of America Corporation, Bank of America 2022 Global Technology Conference, Jun 07, 2022 through Jun 09, 2022
2022-03-17 14:07:00
Bank of America Corporation, Bank of America 2022 Global Technology Conference, Jun 07, 2022 through Jun 09, 2022. Venue: Ritz Carlton, San Francisco, California, United States.
Applied Materials, Inc., $ 0.26, Cash Dividend, May-25-2022
2022-03-10 00:00:00
Applied Materials, Inc., $ 0.26, Cash Dividend, May-25-2022
Society for Information Display, Display Week 2022, May 08, 2022 through May 13, 2022
2022-02-17 22:37:00
Society for Information Display, Display Week 2022, May 08, 2022 through May 13, 2022. Venue: San Jose McEnery Convention Center, San Jose, California, United States.
Society for Information Display, Display Week 2022, May 08, 2022 through May 13, 2022
2022-02-17 22:37:00
Society for Information Display, Display Week 2022, May 08, 2022 through May 13, 2022. Venue: San Jose McEnery Convention Center, San Jose, California, United States.
Applied Materials, Inc., Q2 2022 Earnings Call, May 19, 2022
2022-01-03 11:44:00
Applied Materials, Inc., Q2 2022 Earnings Call, May 19, 2022
Applied Materials and A*STAR Institute of Microelectronics Expand Research Collaboration to Accelerate Heterogeneous Chip Integration with Hybrid Bonding Technology
2021-12-23 09:00:00
Applied Materials, Inc. and the Institute of Microelectronics (IME) announced a new phase of their research collaboration at the Center of Excellence in Advanced Packaging in Singapore. As traditional Moore’s Law scaling slows, chipmakers and systems companies are increasingly looking to heterogeneous design and advanced packaging solutions to enable continued advances in power, performance, area, cost and time-to-market (PPACt). By combining chips of various nodes and functions in a single package, heterogeneous integration also enables smaller form factors and greater design and manufacturing flexibility. An emerging form of heterogeneous integration called hybrid bonding connects chips and wafers with direct copper-to-copper bonding, thereby reducing wiring distances and increasing input/output (I/O) density. This improves power efficiency and enables greater system performance. Under the new phase of their R&D engagement, Applied Materials and A*STAR’s IME aim to accelerate the AI era of computing by driving breakthroughs in heterogeneous integration and advanced packaging for semiconductor innovation. The parties have signed a five-year extension to their existing research collaboration and will make a new, combined investment of approximately USD 210 million to upgrade and expand the Center of Excellence in Advanced Packaging in Singapore to accelerate materials, equipment and process technology solutions for hybrid bonding and other emerging, 3D chip integration technologies.
Applied Materials, Inc. Amends and Restates Company's Bylaws
2021-12-08 22:18:00
On December 3, 2021, the Board of Directors of Applied Materials, Inc. amended and restated the Company's Amended and Restated Bylaws (as so amended, the Bylaws"), effective immediately. The principal amendments to the Bylaws: Section 2.5 was amended to clarify that the number of nominees a stockholder may nominate for election at a stockholders' meeting cannot exceed the number of directors to be elected; Sections 2.5 and 2.15 were amended to require that each nominee for election must represent their intent to serve as a director for the full term for which such nominee is standing for election; Section 2.7 was amended to clarify that the necessary vote for an action by stockholders other than the election of directors is the default standard under the General Corporation Law of Delaware; Section 5.1 was added to provide an Emergency Bylaw provision under the General Corporation Law of Delaware that will activate in the event an emergency condition that prevents the Board or a Board committee from obtaining a quorum for a meeting; Section 6.1 was amended to update the Company's required officer positions to be the president and the secretary; and Section 8.2 was amended to permit any two authorized officers (rather than specified combinations of officers) to sign stock certificates on behalf of the Company.
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on March 16, 2022
2021-12-02 21:05:00
Applied Materials, Inc. announced that its board of directors has approved a quarterly cash dividend of $0.24 per share payable on the company’s common stock. The dividend is payable on March 16, 2022 to shareholders of record as of February 23, 2022.
Applied Materials, Inc. Provides Earnings Guidance for the First Quarter of Fiscal 2022
2021-11-18 21:01:00
Applied Materials, Inc. provided earnings guidance for the first quarter of fiscal 2022. In the first quarter of fiscal 2022, Applied expects net sales to be approximately $6.16 billion, plus or minus $250 million, which includes the expected impact of ongoing supply chain challenges.
Tranche Update on Applied Materials, Inc. (NasdaqGS:AMAT)'s Equity Buyback Plan announced on September 27, 2017.
2021-11-18 16:04:00
From August 2, 2021 to October 31, 2021, the company has repurchased 11,200,000 shares, representing 1.24% for $1,500 million. With this, the company has completed the repurchase of 190,578,918 shares, representing 19.54% for $11,455.73 million under the buyback announced on September 27, 2017.
Applied Materials, Inc. Presents at UBS Global TMT Virtual Conference, Dec-06-2021
2021-11-09 19:30:00
Applied Materials, Inc. Presents at UBS Global TMT Virtual Conference, Dec-06-2021 . Venue: New York, United States. Speakers: Michael Sullivan, Vice President of Investor Relations.
Applied Materials, Inc., Q4 2021 Earnings Call, Nov 18, 2021
2021-11-05 11:30:00
Applied Materials, Inc., Q4 2021 Earnings Call, Nov 18, 2021
Applied Materials Unveils eBeam Metrology System That Enables A New Playbook for Patterning Advanced Logic and Memory Chips
2021-10-18 11:30:00
Applied Materials, Inc. unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements. Advanced chips are built one layer at a time, and each of billions of individual features must be perfectly patterned and aligned to create working transistors and interconnects with optimal electrical characteristics. As the industry increasingly moves from simple 2D designs to more aggressive multipatterning and 3D designs, a commensurate breakthrough in metrology is needed to perfect each critical layer and enable the best performance, power, area-cost and time to market (PPACt™).Traditionally, patterning control has been achieved using optical overlay tools that help align die patterns with “proxy targets” which are guide marks printed into the spaces between die that are removed from the wafer during die singulation. Proxy target approximation has been complemented with statistical sampling of a small number of die patterns from across the wafer. However, after successive generations of feature shrinking, broader adoption of multipatterning, and the introduction of 3D designs that cause interlayer distortions, the traditional approach is leading to measurement deficiencies – or “blind spots” – that are making it more difficult for engineers to correlate intended patterns with on-die results.
Applied Materials, Inc. Presents at 5th Annual Virtual Wells Fargo TMT Summit, Nov-30-2021
2021-10-07 17:42:00
Applied Materials, Inc. Presents at 5th Annual Virtual Wells Fargo TMT Summit, Nov-30-2021 . Speakers: Daniel J. Durn, Senior VP & CFO, Jay Iyer, Managing Director, Investor Relations, Michael Sullivan, Vice President of Investor Relations.
Wells Fargo Securities, LLC, 5th Annual Virtual Wells Fargo TMT Summit, Nov 30, 2021 through Dec 03, 2021
2021-10-07 09:16:00
Wells Fargo Securities, LLC, 5th Annual Virtual Wells Fargo TMT Summit, Nov 30, 2021 through Dec 03, 2021.
Applied Materials, Inc. Presents at Credit Suisse 25th Annual Technology Conference, Nov-30-2021 12:00 PM
2021-10-05 09:20:00
Applied Materials, Inc. Presents at Credit Suisse 25th Annual Technology Conference, Nov-30-2021 12:00 PM. Venue: The Phoenician Hotel, Scottsdale, Arizona, United States. Speakers: Gary E. Dickerson, President, CEO & Executive Director.
Applied Materials, Inc. Announces Executive Changes
2021-10-01 12:30:00
Applied Materials, Inc. announced that Dan Durn, Senior Vice President and Chief Financial Officer (CFO), is departing the company on Oct. 15 to become the CFO at Adobe Inc. Former Applied Materials CFO Bob Halliday has been appointed interim CFO and is serving in the role until a successor is in place.
Applied Materials Announces Executive Change
2021-10-01 12:30:00
Applied Materials, Inc. announced that Dan Durn, Senior Vice President and Chief Financial Officer (CFO), is departing the company on Oct. 15 to become the CFO at Adobe Inc. Former Applied Materials CFO Bob Halliday has been appointed interim CFO and is serving in the role until a successor is in place.
Applied Materials, Inc., 2021 Process Control and AppliedPRO Master Class, Oct 18, 2021
2021-10-01 10:30:00
Applied Materials, Inc., 2021 Process Control and AppliedPRO Master Class, Oct 18, 2021.
Applied Materials, Inc. - Special Call
2021-09-30 09:22:00
To discuss 2021 Process Control and AppliedPRO Master Class
Applied Materials, Inc. to Report Q4, 2021 Results on Nov 18, 2021
2021-09-24 00:00:00
Applied Materials, Inc. announced that they will report Q4, 2021 results on Nov 18, 2021
BrainXchange LLC, EWTS 2021, Oct 13, 2021
2021-09-13 19:33:00
BrainXchange LLC, EWTS 2021, Oct 13, 2021.
Applied Materials, Inc. has closed its Shelf Registration dated February 23, 2010 in the amount of $62.25 million.
2021-09-10 00:00:00
Applied Materials, Inc. has closed its Shelf Registration dated February 23, 2010 in the amount of $62.25 million. Security Name: Common Stock Securities Offered: 5,000,000 Transaction Features: ESOP Related Offering
Applied Materials, Inc. has closed its Shelf Registration dated July 27, 2009 in the amount of $39.57 million.
2021-09-10 00:00:00
Applied Materials, Inc. has closed its Shelf Registration dated July 27, 2009 in the amount of $39.57 million. Security Name: Common Stock Securities Offered: 3,000,000 Transaction Features: ESOP Related Offering
Applied Materials, Inc. has closed its Shelf Registration dated December 05, 2012 in the amount of $163.2 million.
2021-09-10 00:00:00
Applied Materials, Inc. has closed its Shelf Registration dated December 05, 2012 in the amount of $163.2 million. Security Name: Common Stock Securities Offered: 15,000,000 Transaction Features: ESOP Related Offering
Applied Materials, Inc. has closed its Shelf Registration dated December 13, 2019 in the amount of $181.08 million.
2021-09-10 00:00:00
Applied Materials, Inc. has closed its Shelf Registration dated December 13, 2019 in the amount of $181.08 million. Security Name: Common Stock Securities Offered: 3,000,000 Transaction Features: ESOP Related Offering
Applied Materials Introduces New Technologies and Capabilities for Accelerating the Semiconductor Industry's Heterogeneous Integration Roadmap
2021-09-08 11:31:00
Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration. Applied is combining its leadership technologies in advanced packaging and large-area substrates with industry collaborations to speed the availability of solutions that deliver simultaneous improvements in power, performance, area, cost and time to market (PPACt™). Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and system companies by allowing chips of various technologies, functions and sizes to be integrated in one package. Applied is already the largest supplier of advanced packaging technologies with optimized products spanning etch, physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, surface treatments and annealing. Applied’s Advanced Packaging Development Center in Singapore houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding.
Applied Materials, Inc. Announces New Products That Help Enable the Silicon Carbide (Sic) Chipmakers
2021-09-08 11:30:00
Applied Materials, Inc. announced new products that help enable the silicon carbide (SiC) chipmakers transition from 150mm wafer production to 200mm production, which approximately doubles die output per wafer, to help satisfy the world’s growing demand for premium electric vehicle powertrains. SiC wafer surface quality is critically important to SiC device fabrication as any defects on the surface of the wafer will migrate through the subsequent layers. To produce uniform wafers with the highest quality surfaces, Applied has developed the Mirra Durum CMP* system which integrates polishing, measurement of material removal, cleaning and drying in a single system. The new system has demonstrated a 50X reduction in finished wafer surface roughness as compared to mechanically grinded SiC wafers and a 3X reduction in roughness compared to batch CMP processing systems.
Applied Materials, Inc., 2021 ICAPS and Packaging Master Class, Sep 08, 2021
2021-09-07 04:27:00
Applied Materials, Inc., 2021 ICAPS and Packaging Master Class, Sep 08, 2021.
Applied Materials, Inc., 2021 ICAPS and Packaging Master Class, Sep 08, 2021
2021-09-07 04:27:00
Applied Materials, Inc., 2021 ICAPS and Packaging Master Class, Sep 08, 2021.
Applied Materials, Inc. Presents at 2021 ICAPS and Packaging Master Class, Sep-08-2021 09:00 AM
2021-09-07 04:27:00
Applied Materials, Inc. Presents at 2021 ICAPS and Packaging Master Class, Sep-08-2021 09:00 AM. Speakers: Michael Chudzik, VP, TECHNOLOGY, Michael Sullivan, Vice President of Investor Relations, Nirmalya Maity, CVP, ADVANCED PACKAGING, Sundar Ramamurthy, GVP, EPITAXY, PACKAGING & ICAPS.
Applied Materials, Inc. Approves Quarterly Cash Dividend, Payable on December 16, 2021
2021-09-02 20:05:00
Applied Materials, Inc. announced that its Board of Directors has approved a quarterly cash dividend of $0.24 per share payable on the company's common stock. The dividend is payable on December 16, 2021 to shareholders of record as of November 26, 2021.
Applied Materials, Inc., $ 0.24, Cash Dividend, Nov-24-2021
2021-09-02 00:00:00
Applied Materials, Inc., $ 0.24, Cash Dividend, Nov-24-2021
UBS Investment Bank, UBS Global TMT Virtual Conference, Dec 06, 2021 through Dec 08, 2021
2021-08-25 17:29:00
UBS Investment Bank, UBS Global TMT Virtual Conference, Dec 06, 2021 through Dec 08, 2021. Venue: New York, United States.
Applied Materials, Inc. Presents at Semiconductor Big Ideas Conference, Sep-09-2021
2021-08-19 21:49:00
Applied Materials, Inc. Presents at Semiconductor Big Ideas Conference, Sep-09-2021. Presentation Date & Speakers: Sep-09-2021, Gary E. Dickerson, President, CEO & Executive Director, Michael Sullivan, Vice President of Investor Relations.
New Street Research LLP, Semiconductor Big Ideas Conference, Sep 09, 2021
2021-08-19 21:00:00
New Street Research LLP, Semiconductor Big Ideas Conference, Sep 09, 2021.
Applied Materials, Inc. Provides Earnings Guidance for the Fourth Quarter of 2021
2021-08-19 20:01:00
Applied Materials, Inc. provided earnings guidance for the fourth quarter of 2021. For the period, the company expects net sales to be approximately $6.33 billion, plus or minus $250 million.
Tranche Update on Applied Materials, Inc. (NasdaqGS:AMAT)'s Equity Buyback Plan announced on September 27, 2017.
2021-08-19 16:05:00
From May 3, 2021 to August 1, 2021, the company has repurchased 11,200,000 shares, representing 1.23% for $1,494.08 million. With this, the company has completed the repurchase of 179,378,918 shares, representing 18.3% for $9,955.73 million under the buyback announced on September 27, 2017.
Applied Materials, Inc. Presents at Needham Virtual 2nd Annual SemiCap and EDA Conference, Aug-24-2021 12:45 PM
2021-08-17 11:30:00
Applied Materials, Inc. Presents at Needham Virtual 2nd Annual SemiCap and EDA Conference, Aug-24-2021 12:45 PM. Speakers: Daniel J. Durn, Senior VP & CFO.
Applied Materials, Inc. Presents at Deutsche Bank Technology Conference 2021, Sep-10-2021 12:45 PM
2021-08-17 11:30:00
Applied Materials, Inc. Presents at Deutsche Bank Technology Conference 2021, Sep-10-2021 12:45 PM. Speakers: Daniel J. Durn, Senior VP & CFO.
Applied Materials, Inc. Presents at J.P. Morgan 12th Annual U.S. All Stars Conference, Sep-21-2021 12:00 PM
2021-08-17 11:30:00
Applied Materials, Inc. Presents at J.P. Morgan 12th Annual U.S. All Stars Conference, Sep-21-2021 12:00 PM. Speakers: Daniel J. Durn, Senior VP & CFO.
Applied Materials, Inc. Presents at Citi 2021 Global Technology Virtual Conference, Sep-15-2021 01:00 PM
2021-08-17 11:30:00
Applied Materials, Inc. Presents at Citi 2021 Global Technology Virtual Conference, Sep-15-2021 01:00 PM.
Applied Materials, Inc. Presents at 21st Annual Advanced Automotive Battery Conference, Dec-07-2021 through Dec-09-2021
2021-08-11 06:59:00
Applied Materials, Inc. Presents at 21st Annual Advanced Automotive Battery Conference, Dec-07-2021 through Dec-09-2021. Venue: San Diego, California, United States. Presentation Date & Speakers: Dec-07-2021, James Cushing.
Applied Materials, Inc. Presents at Canaccord Genuity 41st Annual Growth Conference, Aug-10-2021 02:00 PM
2021-08-06 12:10:00
Applied Materials, Inc. Presents at Canaccord Genuity 41st Annual Growth Conference, Aug-10-2021 02:00 PM. Speakers: Llew Vaughn-Edmunds, Vice President.
Applied Materials, Inc., Q3 2021 Earnings Call, Aug 19, 2021
2021-08-06 11:30:00
Applied Materials, Inc., Q3 2021 Earnings Call, Aug 19, 2021
JPMorgan Chase & Co., J.P. Morgan 12th Annual U.S. All Stars Conference, Sep 21, 2021 through Sep 23, 2021
2021-07-13 12:19:00
JPMorgan Chase & Co., J.P. Morgan 12th Annual U.S. All Stars Conference, Sep 21, 2021 through Sep 23, 2021.
Fundamental Summary
Looking at Applied Materials's financials of Q1 reflected decent results. Its growth and income factors appear positive and give support for optimism regarding the likelihood of continued positive performance. Bottom line, Applied Materials's financials indicate solid performance in terms of growth and income, which leads us to believe that they may become interesting again in the next few months. But for right now, we gave the company an overall grade of 69 and a HOLD recommendation.
Applied Materials reported earnings results for the second quarter and six months ended May 01, 2022. For the second quarter, the company reported sales was USD 6,245 million compared to USD 5,582 million a year ago. Net income was USD 1,536 million compared to USD 1,330 million a year ago. Basic earnings per share from continuing operations was USD 1.75 compared to USD 1.45 a year ago. Diluted earnings per share from continuing operations was USD 1.74 compared to USD 1.43 a year ago.For the six months, sales was USD 12,516 million compared to USD 10,744 million a year ago. Net income was USD 3,328 million compared to USD 2,460 million a year ago. Basic earnings per share from continuing operations was USD 3.77 compared to USD 2.68 a year ago. Diluted earnings per share from continuing operations was USD 3.74 compared to USD 2.66 a year ago.
Business Description
Applied Materials provides manufacturing equipment, services, and software to the semiconductor, display, and related industries. It operates through three segments: Semiconductor Systems, Applied Global Services, and Display and Adjacent Markets. The Semiconductor Systems segment develops, manufactures, and sells various manufacturing equipment that is used to fabricate semiconductor chips or integrated circuits. This segment also offers various technologies, including epitaxy, ion implantation, oxidation/nitridation, rapid thermal processing, physical vapor deposition, chemical vapor deposition, chemical mechanical planarization, electrochemical deposition, atomic layer deposition, etching, and selective deposition and removal, as well as metrology and inspection tools. The Applied Global Services segment provides integrated solutions to optimize equipment and fab performance and productivity comprising spares, upgrades, services, remanufactured earlier generation equipment, and factory automation software for semiconductor, display, and other products. The Display and Adjacent Markets segment offers products for manufacturing liquid crystal displays; organic light-emitting diodes; and other display technologies for TVs, monitors, laptops, personal computers, electronic tablets, smart phones, and other consumer-oriented devices. The company operates in the United States, China, Korea, Taiwan, Japan, Southeast Asia, and Europe. Applied Materials was incorporated in 1967 and is headquartered in Santa Clara, California.
Sector Overview
Applied Materials is included in the Semiconductors & Semiconductor Equipment according to GICS (global industry classification standard). The Semiconductors & Semiconductor Equipment industry is part of the Information Technology sector. It includes manufacturers of semiconductors, semiconductor equipment, and related products. Applied Materials's industry and sector affiliation are expected to negatively affect their likelihood to overperform the market in the upcoming period, as other sectors appear more likely to benefit from the macroeconomic environment we see now.
Fundamental Highlights
| Parameter | Value | Change | Score | |
|---|---|---|---|---|
| Return on Equity | 57.3 | 2.2% | 73 | |
| Net Cashflow | -2,978.0 | -210.5% | 75 | |
| Capital Expenditure | -697.0 | -0.9% | 69 | |
| Asset Turnover | 1.0 | 1.1% | 72 | |
| Free Cashflow | 5.8 | -12.0% | 59 |
* All values are TTM
The below chart reflects Applied Materials's birds-eye view on its performance with respect to its peers, the company's fillings as reported or to a similar industry, market cap, and country of origin. While Applied Materials's peer average final assessment score stands on 73.0, Applied Materials's score is 69.
- AMAT
- Peers average
Technical Analysis
When trying to optimize the timing of an investment, it's critical to analyze whether the stock looks overbought or oversold, and in which direction the momentum is moving. Applied Materials's stock is now priced above its 5-day, but below its 50-day and 200-day moving average, while its MACD (moving average convergence divergence) indicates that the stock's price movement momentum is weakening. Historically, this is a positive setup in the near-term. Meanwhile, looking at the Stochastic Oscillator and RSI (relative strength index), Applied Materials's stock indicates that it's likely oversold. Overall, these technical indicators signal negative momentum. Therefore, this stock received a cumulative TA (technical analysis) score of 52.
5D MA
95.47
50D MA
108.7
200D MA
131.98
MACD
-4.94
RSI
18.72
STOCH
30.75
Balance Sheet Analysis
Applied Materials appears likely to maintain its strong balance sheet metrics and momentum going forward. Applied Materials assets on their balance sheet, moved to 25459.0, which is a 0.1% change from the last period. This performance is interesting in comparison to its peers and competitors. The company's asset component, therefore, received a grade of 72. Also, In terms of liabilities, Applied Materials published good numbers. Their reported liabilities were 13880.0, representing a 2.5% change from the previous report. These numbers show that management has successfully encouraged growth while managing liabilities, especially relative to their peers. These results statistically lead to positive movement in stock prices, so we rated its liabilities movement component 71. However, one discouraging result, Cash & Equivalents, stood out. Applied Materials did a poor job related to managing cash and cash equivalents this period, which stood at 3331.0, representing a -36.7% change from the previous filing. This performance is significantly less impressive than its peers and competitors. Discouraging results like these statistically lead to negative pressure in stock prices, so we rated their cash and cash equivalents with a score of 41. Because its management is doing an excellent job managing these critical metrics, the balance sheet was given a score of 60.
| Parameter | Value | Change | Score |
|---|---|---|---|
| Assets | 25,459.0 | 0.1% | 72 |
| Liabilities | 13,880.0 | 2.5% | 71 |
| Price to Book | 7.7 | -25.4% | 55 |
| Cash & Equivalents | 3,331.0 | -36.7% | 41 |
| Equity | 11,579.0 | -2.6% | 64 |
The below chart describes Applied Materials's performance as reflected on its balance sheet with respect to its peers. While Applied Materials received a balance sheet score of 60, the average of its peers stands on 72.0.
- AMAT
- Peers average
| Name | Market Cap | Liabilities Movement | Asset Change | Equity/Intangibles Adjustments | Cash & Equivalents | Book Value Momentum | Balance Sheet | mc_sort | Hidden |
|---|---|---|---|---|---|---|---|---|---|
| NVIDIA Corporation | 422.4B | 78 | 70 | 65 | 97 | 54 | 71 | 0 | 1 |
| Intel Corporation | 157.9B | 65 | 69 | 76 | 90 | 81 | 77 | 1 | 1 |
| Texas Instruments Incorporated | 143.5B | 63 | 70 | 87 | 46 | 84 | 76 | 2 | 1 |
| QUALCOMM Incorporated | 142.4B | 57 | 71 | 96 | 80 | 81 | 82 | 3 | 1 |
| Advanced Micro Devices, Inc. | 139.6B | 94 | 61 | 78 | 96 | 81 | 88 | 4 | 1 |
| Broadcom Inc. | 102.5B | 67 | 79 | 59 | 56 | 54 | 62 | 5 | 1 |
| Analog Devices, Inc. | 78.3B | 62 | 80 | 66 | 65 | 66 | 69 | 6 | 1 |
| Micron Technology, Inc. | 65.6B | 73 | 69 | 85 | 76 | 74 | 81 | 7 | 1 |
| Lam Research Corporation | 62.4B | 73 | 77 | 59 | 51 | 45 | 59 | 8 | 1 |
| KLA Corporation | 50.5B | 75 | 62 | 73 | 53 | 66 | 66 | 9 | 1 |
| NXP Semiconductors N.V. | 41.7B | 72 | 68 | 56 | 62 | 76 | 64 | 10 | 1 |
| Marvell Technology, Inc. | 40.5B | 71 | 84 | 50 | 46 | 51 | 60 | 11 | 1 |
| Microchip Technology Incorporated | 33.6B | 65 | 84 | 76 | 72 | 65 | 78 | 12 | 1 |
| GLOBALFOUNDRIES Inc. | 24.5B | 81 | 66 | 73 | 82 | 74 | 78 | 13 | 1 |
| ON Semiconductor Corporation | 23.5B | 74 | 69 | 77 | 88 | 82 | 81 | 14 | 1 |
| Monolithic Power Systems, Inc. | 19.4B | 85 | 65 | 75 | 92 | 80 | 84 | 15 | 1 |
| SolarEdge Technologies, Inc. | 16.5B | 77 | 62 | 77 | 96 | 86 | 82 | 16 | 1 |
| Skyworks Solutions, Inc. | 15.8B | 69 | 77 | 64 | 46 | 52 | 62 | 17 | 1 |
| Teradyne, Inc. | 15.7B | 48 | 81 | 63 | 45 | 47 | 51 | 18 | 1 |
| Entegris, Inc. | 14.2B | 62 | 71 | 75 | 55 | 79 | 70 | 19 | 1 |
| Qorvo, Inc. | 10.6B | 64 | 83 | 64 | 67 | 55 | 67 | 20 | 1 |
| First Solar, Inc. | 7.5B | 77 | 70 | 50 | 58 | 57 | 58 | 21 | 1 |
| Lattice Semiconductor Corporation | 7.2B | 53 | 79 | 79 | 60 | 64 | 68 | 22 | 1 |
| MKS Instruments, Inc. | 6.0B | 59 | 74 | 72 | 76 | 72 | 70 | 23 | 1 |
| Universal Display Corporation | 5.4B | 57 | 76 | 83 | 85 | 70 | 75 | 24 | 1 |
| Silicon Laboratories Inc. | 5.3B | 89 | 81 | 60 | 45 | 47 | 71 | 25 | 1 |
| CMC Materials, Inc. | 5.2B | 65 | 79 | 73 | 87 | 82 | 80 | 26 | 1 |
| Tower Semiconductor Ltd. | 5.1B | 68 | 72 | 69 | 61 | 57 | 65 | 27 | 1 |
| Synaptics Incorporated | 5.1B | 71 | 71 | 78 | 92 | 76 | 81 | 28 | 1 |
| Power Integrations, Inc. | 4.5B | 55 | 82 | 59 | 79 | 56 | 61 | 29 | 1 |
| Amkor Technology, Inc. | 4.3B | 70 | 68 | 75 | 74 | 77 | 74 | 30 | 1 |
| Cirrus Logic, Inc. | 4.1B | 73 | 76 | 81 | 96 | 74 | 86 | 31 | 1 |
| Allegro MicroSystems, Inc. | 4.1B | 68 | 69 | 74 | 80 | 76 | 74 | 32 | 1 |
| Semtech Corporation | 3.6B | 58 | 79 | 68 | 67 | 64 | 67 | 33 | 1 |
| MACOM Technology Solutions Holdings, Inc. | 3.4B | 64 | 75 | 74 | 38 | 75 | 69 | 34 | 1 |
| SunPower Corporation | 3.2B | 72 | 81 | 42 | 83 | 53 | 61 | 35 | 1 |
| FormFactor, Inc. | 3.1B | 72 | 70 | 84 | 82 | 80 | 83 | 36 | 1 |
| Diodes Incorporated | 3.1B | 46 | 78 | 71 | 51 | 72 | 61 | 37 | 1 |
| Silicon Motion Technology Corporation | 2.9B | 40 | 85 | 60 | 40 | 47 | 54 | 38 | 1 |
| Nova Ltd. | 2.8B | 86 | 45 | 76 | 48 | 82 | 61 | 39 | 1 |
| MaxLinear, Inc. | 2.7B | 68 | 71 | 75 | 85 | 75 | 76 | 40 | 1 |
| Ambarella, Inc. | 2.7B | 45 | 75 | 74 | 86 | 65 | 63 | 41 | 1 |
| Kulicke and Soffa Industries, Inc. | 2.7B | 45 | 83 | 61 | 76 | 56 | 57 | 42 | 1 |
| Rambus Inc. | 2.4B | 43 | 82 | 41 | 95 | 54 | 48 | 43 | 1 |
| Canadian Solar Inc. | 2.2B | 91 | 54 | 59 | 62 | 62 | 58 | 44 | 1 |
| Axcelis Technologies, Inc. | 1.9B | 76 | 68 | 85 | 71 | 74 | 81 | 45 | 1 |
| Credo Technology Group Holding Ltd | 1.7B | 94 | 61 | 77 | 79 | 86 | 88 | 46 | 1 |
| Himax Technologies, Inc. | 1.6B | 78 | 55 | 91 | 85 | 95 | 77 | 47 | 1 |
| Impinj, Inc. | 1.4B | 62 | 68 | 78 | 39 | 92 | 72 | 48 | 1 |
| Ultra Clean Holdings, Inc. | 1.4B | 55 | 78 | 68 | 48 | 68 | 63 | 49 | 1 |
| Cohu, Inc. | 1.4B | 52 | 82 | 57 | 59 | 59 | 57 | 50 | 1 |
| Photronics, Inc. | 1.3B | 53 | 85 | 66 | 76 | 66 | 68 | 51 | 1 |
| SMART Global Holdings, Inc. | 1.1B | 90 | 63 | 75 | 95 | 82 | 86 | 52 | 1 |
| Veeco Instruments Inc. | 1.0B | 84 | 72 | 41 | 78 | 47 | 58 | 53 | 1 |
| Alpha and Omega Semiconductor Limited | 957.1M | 89 | 64 | 67 | 87 | 67 | 77 | 54 | 1 |
| PDF Solutions, Inc. | 813.0M | 54 | 81 | 64 | 90 | 51 | 62 | 55 | 1 |
| CEVA, Inc. | 804.5M | 82 | 74 | 60 | 87 | 60 | 73 | 56 | 1 |
| Ichor Holdings, Ltd. | 789.3M | 59 | 76 | 65 | 38 | 63 | 59 | 57 | 1 |
| Maxeon Solar Technologies, Ltd. | 603.6M | 87 | 68 | 40 | 78 | 38 | 53 | 58 | 1 |
| Enphase Energy, Inc. | 27.8B | 89 | 61 | 39 | 97 | 55 | 58 | 59 | 1 |
| Wolfspeed, Inc. | 8.7B | 96 | 63 | 58 | 97 | 56 | 73 | 60 | 1 |
| Daqo New Energy Corp. | 5.4B | 92 | 62 | 81 | 95 | 93 | 93 | 61 | 1 |
| SiTime Corporation | 3.8B | 57 | 67 | 65 | 73 | 64 | 58 | 62 | 1 |
| Onto Innovation Inc. | 3.7B | 84 | 71 | 67 | 72 | 73 | 77 | 63 | 1 |
| JinkoSolar Holding Co., Ltd. | 3.3B | 87 | 62 | 77 | 94 | 94 | 89 | 64 | 1 |
| Camtek Ltd. | 1.1B | 63 | 61 | 82 | 37 | 90 | 66 | 65 | 1 |
| ACM Research, Inc. | 950.7M | 87 | 57 | 51 | 43 | 50 | 52 | 66 | 1 |
| NeoPhotonics Corporation | 837.4M | 89 | 66 | 49 | 72 | 64 | 66 | 67 | 1 |
| Hanwha Q CELLS Co., Ltd. | 818.9M | 60 | 93 | 47 | 85 | 74 | 72 | 68 | 1 |
| indie Semiconductor, Inc. | 752.7M | 49 | 54 | 72 | 56 | 56 | 44 | 69 | 1 |
| Magnachip Semiconductor Corporation | 681.9M | 56 | 78 | 79 | 72 | 72 | 74 | 70 | 1 |
| Mykrolis Corp. | 657.1M | 77 | 53 | 73 | 92 | 79 | 72 | 71 | 1 |
| Navitas Semiconductor Corporation | 575.2M | 37 | 80 | 80 | 62 | 80 | 67 | 72 | 1 |
| Rigetti Computing, Inc. | 426.1M | 94 | 62 | 85 | 99 | 98 | 98 | 73 | 1 |
| ChipMOS TECHNOLOGIES (Bermuda) LTD. | 417.9M | 60 | 71 | 61 | 60 | 69 | 56 | 74 | 1 |
| Meta Materials Inc. | 414.9M | 51 | 78 | 42 | 41 | 51 | 41 | 75 | 1 |
| Helix Technology Corporation | 364.9M | 66 | 77 | 79 | 85 | 52 | 65 | 76 | 1 |
| Valens Semiconductor Ltd. | 350.3M | 92 | 70 | 66 | 45 | 73 | 75 | 77 | 1 |
| Rockley Photonics Holdings Limited | 338.0M | 48 | 82 | 40 | 37 | 52 | 41 | 78 | 1 |
| CyberOptics Corporation | 278.5M | 71 | 66 | 72 | 64 | 86 | 74 | 79 | 1 |
| Transphorm, Inc. | 260.9M | 41 | 87 | 39 | 47 | 55 | 45 | 80 | 1 |
Income Statement Analysis
Overall, Applied Materials's critical income statement metrics appear to signal strong support and a high likelihood of positive growth going forward. In this filing, Applied Materials reported a return on equity (ROE) ratio of 57.3, which represents a change of 2.2%. Its return factor metrics are even more remarkable when compared to their peers. Consequently, their return factors received a grade of 73. Also, Applied Materials reported highly encouraging numbers for its revenue efficiency. This parameter often affects companies in the same industry and market capitalization by up to 18.5%. Their industry-leading revenue efficiency makes a strong case for upward pressure on its's stock price. The company's revenue efficiency, therefore, received a grade of 72. That said, one metric, EBITDA, stood out as strongly negative. Applied Materials reported concerning EBITDA this period. At filing, EBITDA was reported as 8417.0, representing 2.1% change from the previous period. This metric might have a 13.2 percent impact on companies in the same industry and with the same market capitalization. Applied Materials appears to be headed in the wrong direction in terms of EBITDA momentum, likely due to insufficient capital controls and a weaker than expected overall financial performance. Therefore, their EBITDA component earned a score of 68. Consequently, their income statement earned a rank of 72.
| Parameter | Value | Change | Score |
|---|---|---|---|
| EBITDA | 8,417.0 | 2.1% | 68 |
| Total Revenues | 24,835.0 | 2.7% | 72 |
| Return on Equity | 57.3 | 2.2% | 73 |
The below chart describes Applied Materials's performance as reflected on its income statement with respect to its peers. While Applied Materials received a income statement score of 72 , the average of its peers stands on 70.0.
- AMAT
- Peers average
| Name | Market Cap | Revenue Momentum | Earning Movement | Return Factors Momentum | Income Statement | mc_sort | Hidden |
|---|---|---|---|---|---|---|---|
| NVIDIA Corporation | 422.4B | 46 | 83 | 68 | 63 | 0 | 1 |
| Intel Corporation | 157.9B | 90 | 55 | 73 | 76 | 1 | 1 |
| Texas Instruments Incorporated | 143.5B | 69 | 78 | 71 | 74 | 2 | 1 |
| QUALCOMM Incorporated | 142.4B | 48 | 87 | 79 | 66 | 3 | 1 |
| Advanced Micro Devices, Inc. | 139.6B | 40 | 89 | 38 | 59 | 4 | 1 |
| Broadcom Inc. | 102.5B | 59 | 80 | 90 | 71 | 5 | 1 |
| Analog Devices, Inc. | 78.3B | 40 | 91 | 93 | 65 | 6 | 1 |
| Micron Technology, Inc. | 65.6B | 59 | 88 | 90 | 74 | 7 | 1 |
| Lam Research Corporation | 62.4B | 80 | 63 | 75 | 74 | 8 | 1 |
| KLA Corporation | 50.5B | 56 | 77 | 77 | 67 | 9 | 1 |
| NXP Semiconductors N.V. | 41.7B | 59 | 79 | 90 | 71 | 10 | 1 |
| Marvell Technology, Inc. | 40.5B | 41 | 89 | 88 | 64 | 11 | 1 |
| Microchip Technology Incorporated | 33.6B | 57 | 83 | 92 | 71 | 12 | 1 |
| GLOBALFOUNDRIES Inc. | 24.5B | 50 | 93 | 85 | 70 | 13 | 1 |
| ON Semiconductor Corporation | 23.5B | 53 | 92 | 94 | 73 | 14 | 1 |
| Monolithic Power Systems, Inc. | 19.4B | 45 | 90 | 83 | 66 | 15 | 1 |
| SolarEdge Technologies, Inc. | 16.5B | 41 | 70 | 48 | 53 | 16 | 1 |
| Skyworks Solutions, Inc. | 15.8B | 69 | 70 | 63 | 70 | 17 | 1 |
| Teradyne, Inc. | 15.7B | 88 | 57 | 62 | 75 | 18 | 1 |
| Entegris, Inc. | 14.2B | 56 | 80 | 80 | 69 | 19 | 1 |
| Qorvo, Inc. | 10.6B | 76 | 65 | 63 | 71 | 20 | 1 |
| First Solar, Inc. | 7.5B | 98 | 43 | 40 | 73 | 21 | 1 |
| Lattice Semiconductor Corporation | 7.2B | 54 | 88 | 89 | 71 | 22 | 1 |
| MKS Instruments, Inc. | 6.0B | 78 | 66 | 65 | 74 | 23 | 1 |
| Universal Display Corporation | 5.4B | 71 | 63 | 61 | 68 | 24 | 1 |
| Silicon Laboratories Inc. | 5.3B | 44 | 96 | 98 | 70 | 25 | 1 |
| CMC Materials, Inc. | 5.2B | 72 | 76 | 93 | 76 | 26 | 1 |
| Tower Semiconductor Ltd. | 5.1B | 63 | 87 | 82 | 79 | 27 | 1 |
| Synaptics Incorporated | 5.1B | 45 | 91 | 90 | 68 | 28 | 1 |
| Power Integrations, Inc. | 4.5B | 80 | 76 | 83 | 80 | 29 | 1 |
| Amkor Technology, Inc. | 4.3B | 63 | 76 | 77 | 70 | 30 | 1 |
| Cirrus Logic, Inc. | 4.1B | 42 | 92 | 93 | 67 | 31 | 1 |
| Allegro MicroSystems, Inc. | 4.1B | 68 | 48 | 67 | 61 | 32 | 1 |
| Semtech Corporation | 3.6B | 64 | 84 | 87 | 75 | 33 | 1 |
| MACOM Technology Solutions Holdings, Inc. | 3.4B | 74 | 77 | 73 | 76 | 34 | 1 |
| SunPower Corporation | 3.2B | 49 | 43 | 72 | 49 | 35 | 1 |
| FormFactor, Inc. | 3.1B | 79 | 76 | 83 | 80 | 36 | 1 |
| Diodes Incorporated | 3.1B | 66 | 84 | 86 | 76 | 37 | 1 |
| Silicon Motion Technology Corporation | 2.9B | 54 | 83 | 78 | 72 | 38 | 1 |
| Nova Ltd. | 2.8B | 41 | 89 | 78 | 70 | 39 | 1 |
| MaxLinear, Inc. | 2.7B | 56 | 92 | 96 | 75 | 40 | 1 |
| Ambarella, Inc. | 2.7B | 56 | 89 | 79 | 71 | 41 | 1 |
| Kulicke and Soffa Industries, Inc. | 2.7B | 73 | 82 | 85 | 79 | 42 | 1 |
| Rambus Inc. | 2.4B | 48 | 85 | 62 | 64 | 43 | 1 |
| Canadian Solar Inc. | 2.2B | 73 | 76 | 53 | 72 | 44 | 1 |
| Axcelis Technologies, Inc. | 1.9B | 44 | 91 | 91 | 67 | 45 | 1 |
| Credo Technology Group Holding Ltd | 1.7B | 38 | 88 | 63 | 60 | 46 | 1 |
| Himax Technologies, Inc. | 1.6B | 53 | 84 | 66 | 70 | 47 | 1 |
| Impinj, Inc. | 1.4B | 64 | 53 | 52 | 59 | 48 | 1 |
| Ultra Clean Holdings, Inc. | 1.4B | 53 | 73 | 71 | 63 | 49 | 1 |
| Cohu, Inc. | 1.4B | 92 | 53 | 49 | 75 | 50 | 1 |
| Photronics, Inc. | 1.3B | 55 | 86 | 92 | 71 | 51 | 1 |
| SMART Global Holdings, Inc. | 1.1B | 48 | 86 | 68 | 65 | 52 | 1 |
| Veeco Instruments Inc. | 1.0B | 66 | 84 | 91 | 76 | 53 | 1 |
| Alpha and Omega Semiconductor Limited | 957.1M | 62 | 75 | 76 | 69 | 54 | 1 |
| PDF Solutions, Inc. | 813.0M | 49 | 95 | 89 | 71 | 55 | 1 |
| CEVA, Inc. | 804.5M | 51 | 90 | 97 | 71 | 56 | 1 |
| Ichor Holdings, Ltd. | 789.3M | 72 | 60 | 55 | 67 | 57 | 1 |
| Maxeon Solar Technologies, Ltd. | 603.6M | 50 | 49 | 60 | 49 | 58 | 1 |
| Enphase Energy, Inc. | 27.8B | 45 | 74 | 55 | 57 | 59 | 1 |
| Wolfspeed, Inc. | 8.7B | 49 | 90 | 86 | 69 | 60 | 1 |
| Daqo New Energy Corp. | 5.4B | 37 | 96 | 94 | 65 | 61 | 1 |
| SiTime Corporation | 3.8B | 39 | 93 | 78 | 64 | 62 | 1 |
| Onto Innovation Inc. | 3.7B | 47 | 87 | 89 | 67 | 63 | 1 |
| JinkoSolar Holding Co., Ltd. | 3.3B | 38 | 89 | 81 | 62 | 64 | 1 |
| Camtek Ltd. | 1.1B | 50 | 81 | 71 | 68 | 65 | 1 |
| ACM Research, Inc. | 950.7M | 88 | 42 | 42 | 67 | 66 | 1 |
| NeoPhotonics Corporation | 837.4M | 45 | 95 | 90 | 69 | 67 | 1 |
| Hanwha Q CELLS Co., Ltd. | 818.9M | 90 | 59 | 63 | 70 | 68 | 1 |
| indie Semiconductor, Inc. | 752.7M | 37 | 47 | 69 | 43 | 69 | 1 |
| Magnachip Semiconductor Corporation | 681.9M | 94 | 80 | 88 | 90 | 70 | 1 |
| Mykrolis Corp. | 657.1M | 68 | 68 | 58 | 67 | 71 | 1 |
| Navitas Semiconductor Corporation | 575.2M | 56 | 45 | 72 | 53 | 72 | 1 |
| Rigetti Computing, Inc. | 426.1M | 92 | 44 | 69 | 73 | 73 | 1 |
| ChipMOS TECHNOLOGIES (Bermuda) LTD. | 417.9M | 87 | 49 | 76 | 66 | 74 | 1 |
| Meta Materials Inc. | 414.9M | 37 | 45 | 70 | 43 | 75 | 1 |
| Helix Technology Corporation | 364.9M | 89 | 47 | 51 | 74 | 76 | 1 |
| Valens Semiconductor Ltd. | 350.3M | 41 | 86 | 65 | 65 | 77 | 1 |
| Rockley Photonics Holdings Limited | 338.0M | 97 | 50 | 83 | 79 | 78 | 1 |
| CyberOptics Corporation | 278.5M | 54 | 87 | 87 | 71 | 79 | 1 |
| Transphorm, Inc. | 260.9M | 37 | 81 | 97 | 68 | 80 | 1 |
Cash Flow Analysis
Two main cash flow metrics, Net Cash Flow and Asset Turnover, are driving the positive outlook for Applied Materials's financial strength. Applied Materials's strong net cash flow numbers, which were -2978.0 in this filing, showed a -210.5% change from the last period. Their net cash flow metrics are especially remarkable relative to their peers. The company's net cash flow, therefore, received a grade of 75. Also, Applied Materials is doing a remarkable job of keeping its asset turnover under control. At filing, their asset turnover metrics were 1.0, representing a 1.1% change from the previous period. Companies in the same industry and market capitalization are typically affected by this parameter by up to 10.7%. Its asset turnover metrics are especially remarkable relative to their peers. We believe the stock price has room to grow to reflect its intrinsic value accurately. Therefore, its asset turnover movement earned a score of 72. That said, one metric, Free Cash flow, stood out as particularly concerning. Applied Materials's published free cash flow numbers were subpar and could mean that management has lost focus on achieving healthy growth. Applied Materials recorded free cash flow of 5.8, which represents -12.0% growth from the previous report. Companies in the same sector and market capitalization will usually be affected by up to 7.4 percent by this parameter. These free cash flow numbers show that management has not been executing well in generating critical cash flow while also encouraging growth. Disappointing results in free cash flow often lead to negative pressure in stock prices, so we rated their free cash flow with a score of 59. Its cash flow received an overall score of 69.
| Parameter | Value | Change | Score |
|---|---|---|---|
| Net Cashflow | -2,978.0 | -210.5% | 75 |
| Capital Expenditure | -697.0 | -0.9% | 69 |
| Asset Turnover | 1.0 | 1.1% | 72 |
| Free Cashflow | 5.8 | -12.0% | 59 |
The below chart describes Applied Materials's performance as reflected on its cash flow with respect to its peers. While Applied Materials received a cash flow score of 69, the average of its peers stands on 70.0.
- AMAT
- Peers average
| Name | Market Cap | Cashflow Momentum | Free Cashflow Growth | Capital Expenditure Growth | Assets Factors Momentum | Cash Flow | mc_sort | Hidden |
|---|---|---|---|---|---|---|---|---|
| NVIDIA Corporation | 422.4B | 93 | 65 | 61 | 86 | 82 | 0 | 1 |
| Intel Corporation | 157.9B | 57 | 72 | 68 | 53 | 58 | 1 | 1 |
| Texas Instruments Incorporated | 143.5B | 74 | 74 | 63 | 69 | 70 | 2 | 1 |
| QUALCOMM Incorporated | 142.4B | 65 | 65 | 70 | 87 | 77 | 3 | 1 |
| Advanced Micro Devices, Inc. | 139.6B | 93 | 66 | 69 | 37 | 57 | 4 | 1 |
| Broadcom Inc. | 102.5B | 74 | 76 | 87 | 89 | 85 | 5 | 1 |
| Analog Devices, Inc. | 78.3B | 78 | 76 | 51 | 94 | 84 | 6 | 1 |
| Micron Technology, Inc. | 65.6B | 81 | 85 | 81 | 74 | 80 | 7 | 1 |
| Lam Research Corporation | 62.4B | 72 | 60 | 56 | 75 | 68 | 8 | 1 |
| KLA Corporation | 50.5B | 70 | 76 | 52 | 79 | 74 | 9 | 1 |
| NXP Semiconductors N.V. | 41.7B | 59 | 72 | 51 | 85 | 73 | 10 | 1 |
| Marvell Technology, Inc. | 40.5B | 94 | 84 | 58 | 46 | 65 | 11 | 1 |
| Microchip Technology Incorporated | 33.6B | 80 | 79 | 48 | 84 | 79 | 12 | 1 |
| GLOBALFOUNDRIES Inc. | 24.5B | 54 | 86 | 45 | 64 | 64 | 13 | 1 |
| ON Semiconductor Corporation | 23.5B | 60 | 79 | 55 | 74 | 70 | 14 | 1 |
| Monolithic Power Systems, Inc. | 19.4B | 84 | 78 | 59 | 75 | 77 | 15 | 1 |
| SolarEdge Technologies, Inc. | 16.5B | 46 | 38 | 55 | 52 | 43 | 16 | 1 |
| Skyworks Solutions, Inc. | 15.8B | 78 | 57 | 79 | 73 | 71 | 17 | 1 |
| Teradyne, Inc. | 15.7B | 75 | 65 | 66 | 68 | 68 | 18 | 1 |
| Entegris, Inc. | 14.2B | 60 | 57 | 50 | 77 | 65 | 19 | 1 |
| Qorvo, Inc. | 10.6B | 78 | 65 | 87 | 71 | 73 | 20 | 1 |
| First Solar, Inc. | 7.5B | 46 | 84 | 56 | 46 | 53 | 21 | 1 |
| Lattice Semiconductor Corporation | 7.2B | 79 | 77 | 43 | 82 | 77 | 22 | 1 |
| MKS Instruments, Inc. | 6.0B | 58 | 58 | 92 | 56 | 59 | 23 | 1 |
| Universal Display Corporation | 5.4B | 74 | 81 | 68 | 65 | 71 | 24 | 1 |
| Silicon Laboratories Inc. | 5.3B | 70 | 89 | 81 | 88 | 86 | 25 | 1 |
| CMC Materials, Inc. | 5.2B | 72 | 66 | 68 | 80 | 75 | 26 | 1 |
| Tower Semiconductor Ltd. | 5.1B | 76 | 57 | 55 | 58 | 68 | 27 | 1 |
| Synaptics Incorporated | 5.1B | 85 | 62 | 98 | 55 | 67 | 28 | 1 |
| Power Integrations, Inc. | 4.5B | 88 | 77 | 64 | 82 | 82 | 29 | 1 |
| Amkor Technology, Inc. | 4.3B | 46 | 57 | 61 | 71 | 60 | 30 | 1 |
| Cirrus Logic, Inc. | 4.1B | 83 | 98 | 61 | 90 | 91 | 31 | 1 |
| Allegro MicroSystems, Inc. | 4.1B | 56 | 56 | 77 | 56 | 56 | 32 | 1 |
| Semtech Corporation | 3.6B | 79 | 78 | 58 | 79 | 78 | 33 | 1 |
| MACOM Technology Solutions Holdings, Inc. | 3.4B | 46 | 78 | 54 | 78 | 69 | 34 | 1 |
| SunPower Corporation | 3.2B | 84 | 41 | 39 | 93 | 74 | 35 | 1 |
| FormFactor, Inc. | 3.1B | 78 | 81 | 66 | 58 | 68 | 36 | 1 |
| Diodes Incorporated | 3.1B | 77 | 61 | 52 | 80 | 72 | 37 | 1 |
| Silicon Motion Technology Corporation | 2.9B | 63 | 53 | 46 | 85 | 61 | 38 | 1 |
| Nova Ltd. | 2.8B | 58 | 53 | 39 | 56 | 54 | 39 | 1 |
| MaxLinear, Inc. | 2.7B | 90 | 92 | 80 | 81 | 88 | 40 | 1 |
| Ambarella, Inc. | 2.7B | 84 | 95 | 45 | 75 | 80 | 41 | 1 |
| Kulicke and Soffa Industries, Inc. | 2.7B | 93 | 81 | 83 | 74 | 83 | 42 | 1 |
| Rambus Inc. | 2.4B | 96 | 73 | 89 | 89 | 90 | 43 | 1 |
| Canadian Solar Inc. | 2.2B | 69 | 70 | 74 | 68 | 71 | 44 | 1 |
| Axcelis Technologies, Inc. | 1.9B | 81 | 77 | 68 | 85 | 82 | 45 | 1 |
| Credo Technology Group Holding Ltd | 1.7B | 60 | 85 | 37 | 43 | 53 | 46 | 1 |
| Himax Technologies, Inc. | 1.6B | 66 | 77 | 48 | 79 | 67 | 47 | 1 |
| Impinj, Inc. | 1.4B | 70 | 38 | 85 | 73 | 65 | 48 | 1 |
| Ultra Clean Holdings, Inc. | 1.4B | 68 | 41 | 41 | 76 | 62 | 49 | 1 |
| Cohu, Inc. | 1.4B | 92 | 62 | 71 | 44 | 59 | 50 | 1 |
| Photronics, Inc. | 1.3B | 65 | 92 | 96 | 79 | 83 | 51 | 1 |
| SMART Global Holdings, Inc. | 1.1B | 47 | 85 | 95 | 54 | 62 | 52 | 1 |
| Veeco Instruments Inc. | 1.0B | 73 | 82 | 48 | 69 | 71 | 53 | 1 |
| Alpha and Omega Semiconductor Limited | 957.1M | 49 | 64 | 45 | 59 | 54 | 54 | 1 |
| PDF Solutions, Inc. | 813.0M | 81 | 98 | 45 | 92 | 89 | 55 | 1 |
| CEVA, Inc. | 804.5M | 57 | 54 | 84 | 83 | 71 | 56 | 1 |
| Ichor Holdings, Ltd. | 789.3M | 51 | 37 | 87 | 71 | 59 | 57 | 1 |
| Maxeon Solar Technologies, Ltd. | 603.6M | 87 | 90 | 59 | 88 | 84 | 58 | 1 |
| Enphase Energy, Inc. | 27.8B | 89 | 77 | 64 | 40 | 60 | 59 | 1 |
| Wolfspeed, Inc. | 8.7B | 57 | 74 | 76 | 46 | 55 | 60 | 1 |
| Daqo New Energy Corp. | 5.4B | 78 | 86 | 63 | 96 | 89 | 61 | 1 |
| SiTime Corporation | 3.8B | 83 | 87 | 56 | 44 | 62 | 62 | 1 |
| Onto Innovation Inc. | 3.7B | 95 | 65 | 88 | 85 | 85 | 63 | 1 |
| JinkoSolar Holding Co., Ltd. | 3.3B | 67 | 69 | 73 | 78 | 74 | 64 | 1 |
| Camtek Ltd. | 1.1B | 69 | 70 | 74 | 72 | 71 | 65 | 1 |
| ACM Research, Inc. | 950.7M | 62 | 43 | 50 | 54 | 50 | 66 | 1 |
| NeoPhotonics Corporation | 837.4M | 50 | 63 | 67 | 87 | 72 | 67 | 1 |
| Hanwha Q CELLS Co., Ltd. | 818.9M | 64 | 63 | 74 | 73 | 68 | 68 | 1 |
| indie Semiconductor, Inc. | 752.7M | 69 | 80 | 52 | 98 | 85 | 69 | 1 |
| Magnachip Semiconductor Corporation | 681.9M | 65 | 56 | 76 | 54 | 57 | 70 | 1 |
| Mykrolis Corp. | 657.1M | 65 | 69 | 68 | 82 | 75 | 71 | 1 |
| Navitas Semiconductor Corporation | 575.2M | 70 | 87 | 94 | 93 | 90 | 72 | 1 |
| Rigetti Computing, Inc. | 426.1M | 48 | 76 | 51 | 60 | 58 | 73 | 1 |
| ChipMOS TECHNOLOGIES (Bermuda) LTD. | 417.9M | 66 | 64 | 68 | 94 | 73 | 74 | 1 |
| Meta Materials Inc. | 414.9M | 85 | 56 | 68 | 97 | 84 | 75 | 1 |
| Helix Technology Corporation | 364.9M | 75 | 62 | 63 | 56 | 61 | 76 | 1 |
| Valens Semiconductor Ltd. | 350.3M | 53 | 89 | 90 | 46 | 66 | 77 | 1 |
| Rockley Photonics Holdings Limited | 338.0M | 80 | 72 | 66 | 46 | 59 | 78 | 1 |
| CyberOptics Corporation | 278.5M | 49 | 74 | 89 | 78 | 72 | 79 | 1 |
| Transphorm, Inc. | 260.9M | 81 | 87 | 96 | 94 | 88 | 80 | 1 |
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